Vertical Stacked Switch Assembly for Reactive Power Compensation
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Solution Overview
Problem
Current switch assemblies for reactive power compensation apparatuses, particularly those using thyristors, face challenges in optimal arrangement, heat dissipation, and handling due to the bulkiness and weight of thyristors, lacking a comprehensive solution that satisfies all requirements.
Innovation Solution
A switch assembly with a support module and stacked switching modules, featuring cooling plates for heat dissipation, modular design, and a pressing mechanism for easy installation and adjustment, optimizing the arrangement and minimizing occupied space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If thyristors are connected in series to control high voltage or high current, then the reactive power compensation capability is improved, but the weight and bulkiness of the switch assembly increases
Solution Approach 1:
The patent transitions from horizontal arrangement to vertical stacking of thyristors and cooling plates, utilizing the vertical dimension to reduce the horizontal footprint and improve space utilization while maintaining the series connection for high voltage/current capability
2Power
If multiple thyristors are arranged in series for high voltage control, then the voltage control capability is improved, but the arrangement complexity and insulation requirements increase
Solution Approach 1:
The switch assembly is segmented into modular units where each thyristor is paired with its own cooling plate and insulation structure. This segmentation allows for standardized, repeatable modules that reduce overall arrangement complexity while achieving the required series voltage capability
Solution Approach 2:
Insulation and cooling structures are optimized locally around each thyristor rather than using a single complex insulation system for the entire assembly. Each module has its own customized insulation and cooling configuration tailored to the local thermal and electrical requirements
3Volume of stationary object
If thyristors are densely packed to minimize space, then the occupied volume is reduced, but the heat dissipation difficulty increases
Solution Approach 1:
The cooling plates are merged with the structural support elements of the assembly, serving dual functions of thermal management and mechanical support. This integration allows for efficient heat dissipation without requiring additional dedicated cooling space
Solution Approach 2:
Heat dissipation is optimized by utilizing vertical stacking with cooling plates positioned above and below each thyristor, creating thermal pathways in the vertical dimension rather than relying solely on horizontal heat spread, thereby improving heat dissipation efficiency while maintaining compact volume
4Ease of manufacture
If traditional switch assembly structures are used, then the manufacturing process is simple, but the installation and handling difficulty increases due to bulkiness
Solution Approach 1:
The switch assembly is divided into separate, manageable modules (thyristor units with integrated cooling plates) that can be manufactured independently and then assembled. This segmentation makes each component lighter and easier to handle during installation while maintaining manufacturing simplicity through standardized modular designs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for efficient heat dissipation, optimized arrangement, and easier handling of thyristors, enhancing the performance and installation of reactive power compensation apparatuses by stacking switches vertically and using cooling plates for thermal management.
Implementation Method 1
first through (n+1)th cooling plates stacked along a vertical direction with respect to the support module; first through nth switches respectively disposed between the first through (n+1)th cooling plates
Data Source
AI summary
Each of the first and second switching modules may include first through (n+1)th cooling plates stacked along a vertical direction with respect to the support module; first through nth switches respectively disposed between the first through (n+1)th cooling plates; a first electrode plate disposed on the (n+1)th cooling plate; a first supporting member disposed on the first electrode plate; a first pressing member disposed between the first electrode plate and the first supporting member; a second electrode plate disposed below the first cooling plate; a second supporting member disposed below the second electrode plate; and a second pressing member disposed between the second electrode plate and the second supporting member.