Vertical External Storage Venting for Compact Heat Dissipation
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Solution Overview
Problem
External data storage devices experience performance degradation and reduced lifespan due to overheating, especially as they become miniaturized, necessitating improved heat dissipation solutions.
Innovation Solution
The external data storage device is designed to be positioned vertically on the ground, featuring a thermal vent on the uppermost surface and an air inlet on the lowermost surface, enhancing heat dissipation through thermal radiation and convection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the external data storage device is miniaturized to improve portability, then the device size is reduced, but heat dissipation performance deteriorates
Solution Approach 1:
The patent changes the orientation of the data storage device from horizontal to vertical placement. By positioning the device vertically on the ground using the case stand, heat can dissipate more effectively in the vertical direction through natural convection and radiation, solving the heat dissipation problem without increasing device volume.
Solution Approach 2:
The patent separates the heat dissipation function from the storage function by adding a dedicated case stand structure. The case stand not only provides vertical positioning but also creates space for air circulation and thermal vent operation, segmenting the overall system to address heat dissipation independently from the compact storage design.
2Temperature
If the thermal vent is positioned on the uppermost surface to improve heat dissipation, then heat dissipation efficiency is enhanced, but the device requires vertical positioning which may reduce stability
Solution Approach 1:
The case stand acts as a counterbalancing structure that provides a wide base support, creating stability that counteracts the potential instability from vertical positioning. The stand's structure compensates for the elevated center of gravity, ensuring the device remains stable while maintaining the optimal vertical orientation for heat dissipation.
3Temperature
If the air inlet is formed in the lowermost surface to maximize airflow for convection, then heat dissipation is improved, but the device becomes more susceptible to moisture and water ingress
Solution Approach 1:
The patent positions the air inlet on the lowermost surface, which is closer to the ground, to maximize the benefit of natural convection currents that rise upward. This positioning takes advantage of the natural flow of air from bottom to top, enhancing heat dissipation while the thermal vent's upward orientation naturally prevents water ingress by allowing condensation to drain away from critical components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat dissipation performance by maximizing airflow and convection, maintaining device performance and extending its lifespan.
Implementation Method 1
improve the heat dissipation performance by utilizing thermal radiation and the convection phenomenon
Implementation Method 2
improve the heat dissipation performance by utilizing thermal radiation and the convection phenomenon
Data Source
AI summary
The present technology provides an external data storage device comprising: a memory module including a plurality of semiconductor chips suitable for storing data received from an external device; a case including a plurality of surfaces surrounding the memory module; and a case stand suitable for supporting the case in an approximately vertical direction on a ground.