Vertical Substrate Buffer Layout for Compact Interface Handling
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Solution Overview
Problem
Current substrate treating apparatuses have a large interface block due to the inclusion of multiple substrate transport mechanisms, which increases the footprint and complexity, making them less compact.
Innovation Solution
A substrate treating apparatus with an indexer block, a first treating block, and a second treating block, where the indexer block includes a substrate buffer and an indexer mechanism, and the first treating block has an interface layer and a treatment layer, allowing for compact configuration by reducing the need for multiple transport mechanisms and optimizing the layout.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple substrate transport mechanisms are included in the interface block, then substrate transport capability is improved, but the footprint and device complexity increase
Solution Approach 1:
The patent transitions from horizontal arrangement of transport mechanisms to vertical stacking of treatment layers. Multiple treatment layers are arranged in the up-down direction, allowing substrate transport mechanisms to operate vertically between layers rather than horizontally across a large footprint. This dimensional change maintains transport capability while reducing the horizontal area occupied by the interface block.
Solution Approach 2:
The patent combines multiple treatment layers (coating-treatment layer and developing-treatment layer) into a single vertical stack within the interface block. By merging these layers and sharing substrate transport mechanisms between them, the system achieves multi-functional capability without proportionally increasing the footprint, as multiple layers share the same horizontal space through vertical stacking.
2Productivity
If multiple substrate transport mechanisms are included in the interface block, then substrate transport capability is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple treatment layers into a shared vertical structure where substrate transport mechanisms serve multiple layers simultaneously. Instead of having separate transport mechanisms for each treatment layer, the system uses shared transport mechanisms that move substrates vertically between stacked layers, reducing the total number of mechanisms and simplifying the overall device architecture.
Solution Approach 2:
The substrate transport mechanisms are designed with multi-functionality to handle substrates across different treatment layers. A single transport mechanism can perform multiple functions by transporting substrates between different vertical levels, eliminating the need for dedicated transport mechanisms for each layer and thereby reducing device complexity while maintaining comprehensive transport capability.
3Volume of moving object
If treatment layers are arranged in up-down direction, then vertical space utilization is improved, but substrate access to buffer units becomes more complex
Solution Approach 1:
The patent explicitly designs the substrate buffer to have buffer units arranged at different height positions corresponding to different treatment layers. This vertical arrangement in the up-down direction maximizes space utilization by stacking buffer units vertically rather than spreading them horizontally. The indexer mechanism is designed to access these vertically stacked buffer units, making the vertical configuration work efficiently rather than creating complexity.
Solution Approach 2:
The indexer mechanism serves as an intermediary that facilitates substrate access between the vertically stacked buffer units and treatment layers. This intermediary mechanism is specifically designed to handle the vertical movement and positioning required by the stacked configuration, mediating between the vertical buffer arrangement and the treatment processes, thereby simplifying access rather than creating complexity.
Data Source
AI summary
Disclosed are a substrate treating apparatus and a substrate transporting method. A first treating block includes a developing-treatment layer and an interface layer arranged in an up-down direction. Accordingly, the interface layer is couplable with the indexer block. Moreover, a substrate transport mechanism of the indexer block transports a substrate from one of buffer units located at a predetermined height position in a substrate buffer to another of the buffer units located at a different height position in the substrate buffer. Accordingly, the interface layer is accessible to the buffer unit located at a height position corresponding to the interface layer. Thus, the interface layer can be made compact. Moreover, the interface layer is located in the upper part or the lower part of the developing-treatment layer, leading to reduction in footprint.