Vertical Substrate Edge Processing With Circulation Grooves

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Solution Overview

Problem

Existing substrate processing apparatuses face challenges in reducing installation area and improving productivity due to horizontal substrate holding, which leads to chemical solution scattering and increased consumption, especially when processing the outer peripheral portion of substrates.

Innovation Solution

A substrate processing apparatus that vertically erects multiple substrates, uses circulation grooves for chemical solution, rinse solution, and dry fluid processing, and adjusts processing width through control units and driving units to optimize film removal and measurement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If substrates are held horizontally during processing, then chemical solution processing can be performed, but the installation area of the substrate processing apparatus increases

Engineering Contradiction:

Improvechemical solution processing capabilityVSAvoidinstallation area

Core Design Contradiction:

Ease of operationVSArea of stationary object

Solution Approach 1:

The patent transitions from horizontal substrate holding to vertical substrate holding, changing the spatial dimension of substrate orientation. This dimensional change allows multiple substrates to be stacked vertically, thereby reducing the horizontal installation area while maintaining chemical solution processing capability through circulation grooves that deliver solutions along the vertical substrate surfaces

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Productivity

If substrates are held horizontally, then processing can be performed, but chemical solution scatters and consumption increases

Engineering Contradiction:

Improveprocessing capabilityVSAvoidchemical solution consumption

Core Design Contradiction:

ProductivityVSLoss of substance

Solution Approach 1:

The patent employs hydraulic circulation systems with circulation grooves carved into the substrates. These grooves channel chemical solutions in controlled flow paths along the substrate surfaces, preventing uncontrolled scattering. The hydraulic design ensures precise solution delivery to targeted areas, reducing overall chemical consumption while maintaining effective processing

Inventive Principle:

Principle #29Pneumatics and hydraulics

Solution Approach 2:

The circulation grooves act as integrated fluid channels embedded within the substrate structure itself. This integrated design allows the substrate to guide and contain the chemical solution flow along its surface, preventing scattering outside the intended processing zones and reducing solution waste

Inventive Principle:

Principle #30Flexible shells and thin films

3Productivity

If multiple substrates are processed, then productivity improves, but installation area increases when held horizontally

Engineering Contradiction:

Improvebatch processing capabilityVSAvoidinstallation area

Core Design Contradiction:

ProductivityVSArea of stationary object

Solution Approach 1:

The patent utilizes vertical stacking of multiple substrates in a layered configuration, transforming the horizontal arrangement into a vertical three-dimensional structure. This allows multiple substrates to occupy the same horizontal footprint by stacking them vertically, thereby increasing batch processing capacity without expanding the installation area

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

Multiple substrates are nested vertically within the processing chamber, with each substrate positioned above the other in a stacked arrangement. The circulation grooves in each substrate independently channel solutions, enabling simultaneous processing of multiple nested substrates in a compact vertical space

Inventive Principle:

Principle #7Nested doll (Nesting)

Data Source

PatentUS20260096382A1Substrate processing apparatus, substrate processing method, and method of manufacturing semiconductor device

Publication Date: 2026.04.02 KIOXIA CORP

AI summary

A substrate processing apparatus includes: a plurality of roller pairs configured to place a plurality of substrates, respectively, wherein the substrates are arranged side by side in a horizontal direction with a predetermined interval, and rotate the plurality of substrates, respectively, in a circumferential direction; a first, second, and third circulation groove that are disposed along outer peripheral portions of each of the plurality of substrates; a chemical solution supplier configured to supply a chemical solution to the outer peripheral portions of the plurality of substrates through the first circulation groove; a rinse solution supplier configured to supply a rinse solution to the outer peripheral portions of the plurality of substrates through the second circulation groove; and a fluid supplier configured to supply a fluid for drying the rinse solution to the outer peripheral portions of the plurality of substrates through the third circulation groove.