Vertical Substrate Loading for Uniform Graphene Processing
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in uniformly processing large-area substrates due to space requirements and sagging issues, leading to increased costs and inefficient thermal processing, and there is a lack of cost-effective methods for mass-producing high-quality graphene thin films.
Innovation Solution
A substrate processing apparatus with a vertically loaded chamber design, featuring first and second susceptors and a heat source unit that allows for efficient radiation light collection and thermal transfer, enabling uniform heating and reduced space requirements, along with a gas injection and exhaust system for controlled processing, and the use of materials like graphite or SiC for susceptors to support the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the substrate is horizontally loaded in the chamber to process large-area substrates, then the substrate can be accommodated, but the chamber volume increases significantly requiring wide installation space
Solution Approach 1:
The patent changes the substrate loading orientation from horizontal to vertical direction. The substrate is loaded vertically into the chamber through the door, allowing large-area substrates to be accommodated without increasing chamber volume. The vertical arrangement utilizes the height dimension of the chamber rather than expanding the horizontal footprint, thus reducing installation space requirements while maintaining the ability to process large-area substrates
2Area of stationary object
If the substrate is horizontally loaded in the chamber, then the substrate can be processed, but another space for storing the substrate is required increasing equipment costs
Solution Approach 1:
By switching from horizontal to vertical substrate loading, the chamber structure is optimized to eliminate the need for additional horizontal storage spaces. The vertical configuration allows substrates to be stacked or positioned in the height direction, reducing the overall equipment footprint and minimizing auxiliary storage requirements, thereby lowering equipment costs
3Area of stationary object
If the substrate is horizontally loaded, then the substrate can be processed, but the substrate sags downward due to its own weight making uniform processing difficult
Solution Approach 1:
The vertical loading orientation changes the gravitational force direction relative to the substrate plane. When substrates are loaded vertically, gravity acts parallel to the substrate surface rather than perpendicular to it, preventing sagging and maintaining substrate flatness during processing. This ensures uniform thermal and chemical processing across the entire substrate area
4Temperature
If conventional thermal processing methods are used, then the substrate can be heated, but the heating and cooling process is slow reducing productivity
Solution Approach 1:
The patent replaces conventional conduction-based heating methods with radiation-based heating using a heat source that emits radiation light directly onto the substrate. This radiation heating method enables rapid temperature increase and decrease, significantly reducing processing time and improving productivity compared to traditional furnace-based thermal processing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves uniform processing of large-area substrates with reduced space and cost, enabling efficient mass-production of graphene thin films with improved electrical, mechanical, and chemical properties, while minimizing equipment costs and thermal damage.
Implementation Method 1
a heat source irradiating radiation light to heat the substrate
Data Source
AI summary
The present invention relates to a substrate processing apparatus. The substrate processing apparatus includes a chamber including a chamber body of which one side is opened and having an inner space and a door opening and closing the chamber body, first susceptors disposed to be spaced apart from each other within the chamber, supports each of which is connected to one side surface of the door to support the substrate in parallel to the first susceptor, second susceptors disposed on the supports along a longitudinal direction of the door, the second susceptors being spaced apart from each other in a direction crossing the first susceptors, and at least one heat source unit disposed at least one surface of the chamber to heat the susceptors.


