Vertically Aligned Substrate Processing System with Inter-Chamber Cooling
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Solution Overview
Problem
Existing substrate processing systems face challenges in temperature control and footprint expansion during substrate processing, particularly in dual load-lock chambers where sufficient temperature control is difficult to achieve and the system's footprint increases with additional processing modules.
Innovation Solution
A substrate processing system with two vertically aligned chambers of equal footprint, where a cooling passage is disposed between them, allowing coolant flow to manage temperature and prevent footprint expansion, incorporating a first chamber for processing in a vacuum atmosphere and a second chamber for cooling and atmospheric transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If additional processing modules are added to substrate processing systems, then processing capability is improved, but the system's footprint increases
Solution Approach 1:
The patent transitions from a horizontal arrangement of processing chambers to a vertical stacking configuration. Multiple processing chambers are arranged in the vertical dimension, allowing the system to accommodate more processing modules without increasing the horizontal footprint area.
Solution Approach 2:
The patent implements a nested structure where processing chambers are vertically stacked within a compact footprint. The chambers are arranged one above another, creating a space-efficient configuration that maximizes processing capability within a limited horizontal area.
2Adaptability or versatility
If dual load-lock chambers are used for substrate processing, then processing flexibility is improved, but temperature control becomes difficult
Solution Approach 1:
The patent divides the thermal management system into separate, independent zones for each processing chamber. Each chamber has its own heating and cooling mechanisms, allowing independent temperature control that prevents thermal interference between adjacent chambers while maintaining processing flexibility.
Solution Approach 2:
The patent introduces thermal isolation barriers and independent thermal management systems as intermediaries between processing chambers. These intermediaries prevent heat transfer between chambers, enabling each chamber to maintain its required temperature independently without affecting others.
3Area of stationary object
If vertically stacked chambers are implemented, then footprint is reduced, but thermal interference between chambers increases
Solution Approach 1:
The patent extracts and removes thermal pathways between vertically stacked chambers by implementing thermal isolation barriers. This extraction of heat transfer paths prevents thermal interference while maintaining the compact vertical configuration, allowing each chamber to be thermally independent.
Solution Approach 2:
The patent introduces thermal isolation barriers and insulation layers as intermediaries between vertically stacked chambers. These intermediaries block heat transfer between chambers, enabling the system to achieve both compact footprint and effective thermal management simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient temperature control and substrate processing without increasing the system's footprint, allowing for flexible processing sequences and efficient substrate transfer while maintaining a compact design.
Implementation Method 1
a cooling passage disposed between the first chamber and the second chamber and configured to allow a coolant to flow therethrough
Data Source
AI summary
A substrate processing system includes a first chamber, a second chamber, and a cooling passage. The first chamber has therein a space for processing a substrate transferred from a first transfer chamber maintained in a vacuum atmosphere. The second chamber is disposed below the first chamber to be vertically aligned with the first chamber and configured to communicate with the first transfer chamber and a second transfer chamber maintained in an atmospheric atmosphere. The second chamber has substantially the same footprint as a footprint of the first chamber. Further, a cooling passage is disposed between the first chamber and the second chamber and configured to allow a coolant to flow therethrough.