Vertical Substrate Processing Device with Moving Loader
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Solution Overview
Problem
Existing substrate processing systems face challenges in increasing throughput while maintaining cost-effectiveness, particularly in semiconductor manufacturing where prolonged vacuum processing times require more efficient handling of substrates across multiple process chambers.
Innovation Solution
A substrate processing device is designed with an equipment front end module (EFEM) and multiple stages of processing units arranged along a moving path, featuring a substrate loading part that can move vertically and transfer substrates between the EFEM and processing modules, allowing for efficient transfer and processing of multiple substrates in a shelf configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of process chambers is increased to improve throughput, then productivity increases, but device complexity and cost increase sharply
Solution Approach 1:
The patent transitions from a horizontal arrangement of process chambers to a vertical stacked configuration. Multiple process chambers are arranged in the vertical direction, allowing substrates to be processed in parallel across different height levels. This dimensional change enables increased throughput without proportionally increasing the horizontal footprint and transfer mechanism complexity.
Solution Approach 2:
The patent implements a nested structure where a substrate loading part containing multiple substrate holders is positioned to access multiple process chambers simultaneously. The substrate loading part can hold substrates at different vertical levels, allowing nested arrangement of processing stages within a compact vertical space, thereby increasing capacity without linearly increasing system complexity.
2Reliability
If process time is extended for complex vacuum processing, then processing quality improves, but productivity decreases
Solution Approach 1:
The patent enables continuous substrate processing by implementing a system where multiple substrates are processed simultaneously in parallel vacuum chambers. While one substrate undergoes extended vacuum processing, other substrates can be loaded, unloaded, or processed in other chambers. This continuous operation maintains high processing quality through proper vacuum conditions while preventing idle time and maintaining high throughput.
Solution Approach 2:
The patent divides the processing system into multiple independent vacuum chambers, each capable of processing substrates simultaneously. This segmentation allows the processing of multiple substrates in parallel, so that extended process time for individual substrates does not reduce overall productivity, as other substrates are being processed concurrently in separate chambers.
3Ease of operation
If a linear robot is used for substrate transfer, then ease of operation improves, but device complexity increases due to multiple transfer mechanisms
Solution Approach 1:
The patent implements a universal substrate loading part that can interface with multiple process chambers positioned at different vertical levels. This single loading part structure serves multiple functions: loading substrates into different chambers, holding substrates during processing, and enabling transfer between chambers. This multi-functional design reduces the need for separate transfer mechanisms for each chamber pair, simplifying the overall system while maintaining ease of operation.
Data Source
AI summary
Four groups of a three-tier arrangement of processing units, each of the processing units being provided with two processing modules and a load lock module, are provided in the front and rear sides along a Y-guide extending rearward when viewed from an EFEM and in the left and right sides of the Y-guide. An exchange of a substrate between a delivery mechanism on the EFEM side and a substrate transfer mechanism on the processing unit side is performed by a substrate loading part, which is movable along the Y-guide and can move upward and downward, and on which a plurality of wafers can be placed in a shelf-like manner.