Vertical In-Line Substrate Processing System for OLED Manufacturing
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Solution Overview
Problem
Existing substrate processing systems for OLED displays face challenges in efficiently handling large area substrates, particularly in reducing the footprint and minimizing contamination due to particle generation and atmospheric exposure during mask and carrier handling in horizontal orientations.
Innovation Solution
A vertical in-line substrate processing system is introduced, featuring a glass handling module with vacuum orientation capabilities, mask handling modules that maintain vacuum conditions, and deposition modules with 'folded' paths to reduce length and width, allowing for efficient processing and handling of large area substrates while minimizing exposure to atmospheric conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a horizontal in-line substrate processing system is used, then substrate processing can be performed with established equipment architecture, but the system footprint is large and contamination from atmospheric exposure occurs during mask and carrier handling
Solution Approach 1:
The patent transitions from a horizontal substrate processing system to a vertical system where substrates are processed in a standing orientation. The deposition sources are positioned above the substrates rather than below, and the substrate carriers move vertically through the processing chambers. This dimensional change allows for a more compact footprint while maintaining processing capabilities.
Solution Approach 2:
The patent inverts the conventional horizontal processing approach by using vertical processing chambers where substrates are oriented vertically. The mask and carrier handling occurs in a vacuum environment rather than atmospheric conditions, reversing the traditional sequence of operations and eliminating the need for separate atmospheric return paths.
2Device complexity
If mask and carrier handling is performed in atmospheric conditions, then equipment simplicity is maintained, but particle generation and contamination occur
Solution Approach 1:
The patent maintains a vacuum environment throughout the entire processing system, including the mask and carrier handling areas. By eliminating atmospheric conditions from the processing environment, particle generation and contamination are prevented. The vacuum state is preserved in all chambers and transfer paths, creating a contamination-free inert environment.
Solution Approach 2:
The patent combines the mask handling, carrier handling, and substrate processing functions into a single integrated vacuum environment. Rather than separating these functions into different atmospheric and vacuum zones, all operations occur within the vacuum system, eliminating the need for atmospheric exposure during handling operations.
3Area of stationary object
If a vertical processing system is implemented, then system footprint is reduced, but substrate handling complexity increases
Solution Approach 1:
The vertical substrate carriers are designed to perform multiple functions: they hold the substrates in a vertical orientation, transport them through the processing chambers, position them for deposition, and facilitate mask attachment and removal. This multi-functionality reduces the need for separate specialized components for each operation.
Solution Approach 2:
The system uses dynamically adjustable positioning mechanisms that can adapt the vertical position and orientation of substrates during processing. The carriers and processing chambers can move and adjust in real-time to optimize deposition parameters and handle different substrate sizes and configurations.
4Productivity
If deposition sources are positioned below the substrate, then conventional processing methodology is maintained, but processing efficiency for large area substrates is reduced
Solution Approach 1:
The patent inverts the conventional deposition geometry by positioning deposition sources above the vertically oriented substrates rather than below them. This inversion allows for more efficient material deposition on large area substrates by utilizing gravity-assisted material flow and improving vapor distribution across the substrate surface.
Solution Approach 2:
The patent changes the spatial parameters of the deposition system by transitioning from horizontal to vertical orientation. This parameter change optimizes the deposition process for large area substrates by improving material uniformity, reducing deposition time, and enhancing control over layer thickness and quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system significantly reduces the footprint and width of the processing system, minimizes contamination, and enhances processing efficiency by maintaining vacuum conditions for masks and carriers, enabling effective deposition of organic and metallic layers on large area substrates.
Implementation Method 1
deposition of organic materials and metallic materials on a substrate in a high vacuum
Implementation Method 2
a vacuum orientation chamber or oriented the substrate vertically by applying gravitational force to align the substrate in a non-horizontal orientation
Data Source
AI summary
A substrate processing system for processing of a plurality of substrates is described. The system includes a first deposition module being a first in-line module and having a first plurality of vacuum deposition sources; a second deposition module being a second in-line module and having a second plurality of vacuum deposition sources; and a glass handling module between the first deposition module and the second deposition module.