Vertical Substrate Stacking in Processing Chamber for High Throughput
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in achieving high throughput while maintaining a small footprint and ensuring uniformity of film processing, often resulting in variations in ashing rate and film uniformity due to increased processing chambers and varying exhaust flows.
Innovation Solution
The apparatus includes a processing chamber with a substrate placing base surrounded by exhaust holes and a retracting space for the substrate transporting member, allowing for efficient gas exhaustion and processing gas supply, ensuring uniform gas flow and high throughput without expanding the footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If processing chambers are added to increase throughput, then productivity is improved, but the footprint of the apparatus increases
Solution Approach 1:
The patent transitions from a horizontal arrangement of multiple processing chambers to a vertical arrangement with multiple substrate placing bases stacked above each other within a single processing chamber. This dimensional change allows multiple substrates to be processed simultaneously without increasing the horizontal footprint, thereby maintaining high throughput while keeping the apparatus compact.
Solution Approach 2:
The patent implements a nested configuration where multiple substrate placing bases are vertically stacked within the same processing chamber space. The substrate transporting member operates in the vertical dimension to access different levels, effectively nesting multiple processing positions within a single chamber volume, thus increasing productivity without expanding the overall apparatus footprint.
2Productivity
If the substrate transporting member is upsized to handle multiple substrates, then productivity is improved, but the footprint and chamber space requirements increase
Solution Approach 1:
The substrate transporting member is designed with movable and adjustable components that allow it to dynamically adapt its configuration. The member can extend and retract, and adjust its position vertically to access different substrate placing bases, enabling it to handle multiple substrates without requiring a permanently enlarged chamber space. This dynamic design maintains productivity while minimizing the required chamber volume.
3Manufacturing precision
If exhaust holes are positioned close to the substrate placing base to improve gas flow efficiency, then processing uniformity is improved, but the substrate transporting member cannot access the substrate
Solution Approach 1:
The patent resolves the spatial conflict by utilizing the vertical dimension. The substrate transporting member approaches substrates from above in the vertical direction, while exhaust holes are positioned around the lower portion of the substrate placing base. This vertical separation allows both functions to coexist without interference, maintaining both processing uniformity and substrate accessibility.
Solution Approach 2:
The patent introduces a retractable baffle or shield structure that acts as an intermediary between the substrate transporting member and the exhaust holes. This intermediary component can be repositioned to allow the transporting member to access substrates when needed, while maintaining proper exhaust flow paths during processing, thus mediating between the conflicting requirements of accessibility and processing uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves high throughput of 250 pieces per hour with improved uniformity in wafer resist removal, maintaining a compact design and ensuring uniform ashing distribution across the substrate.
Implementation Method 1
exhaust holes provided so as to surround the substrate placing base
Data Source
AI summary
A substrate processing apparatus includes a processing chamber that processes a substrate, and a substrate placing base enclosed in the processing chamber, and a substrate transporting member that allows the substrate to wait temporarily on the substrate placing base, and exhaust holes provided so as to surround the substrate placing base, and a retracting space that allows the substrate transporting member to move in between lines each connecting the exhaust hole and an upper end of the substrate placing base and the substrate placing base.