Vertical Temperature Sensor Layout for Substrate Processing Space

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing temperature sensor configurations in semiconductor manufacturing interfere with substrate processing, hindering accurate temperature measurement and control within the processing space.

Innovation Solution

A temperature sensor is positioned between substrates supported by a substrate support, with a detector column extending vertically to maintain the sensor's lower end at the same or higher height than the support, and positioned further from the processing space than the support columns, allowing for accurate temperature measurement without interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If the temperature sensor is disposed in the processing space, then the temperature measurement accuracy is improved, but the sensor interferes with various processes performed on the substrate

Engineering Contradiction:
Improvetemperature measurement accuracyVSAvoidinterference with substrate processing
Core Design Contradiction:
Measurement precisionVSObject-affected harmful factors

Solution Approach 1:

The temperature sensor is positioned in the vertical dimension above the substrate support rather than in the horizontal processing space. The detector column extends vertically with the temperature measurer positioned at a height that allows temperature measurement without horizontal interference with substrate processing operations.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

A detector column structure serves as an intermediary between the temperature measurer and the substrate support. This column positions the temperature sensor at an appropriate height and distance, allowing temperature detection while preventing direct interference with substrate processing in the horizontal plane.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If the temperature sensor is positioned closer to the substrate for accurate measurement, then the temperature control precision is improved, but the sensor may contact or interfere with the substrate and support structures

Engineering Contradiction:
Improvetemperature control precisionVSAvoidrisk of contact with substrate
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The invention transitions from horizontal positioning near the substrate to vertical positioning above it. The temperature measurer is placed at a controlled height above the substrate support, achieving close proximity for accurate measurement while the vertical separation prevents contact and reliability issues.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The detector column provides localized structural support and positioning, creating a specific spatial relationship between the temperature sensor and substrate. This localized structure ensures the sensor maintains optimal measurement distance while preventing interference with substrate processing zones.

Inventive Principle:
Principle #3Local quality

Data Source

PatentEP4485512A1Temperature sensor, substrate processing apparatus, method of manufacturing semiconductor device, and temperature control system
Publication Date: 2025.01.01 KOKUSAI DENKI KK
  • EP4485512A1 patent drawingFigure 1
  • EP4485512A1 patent drawingFigure 2
  • EP4485512A1 patent drawingFigure 3A~3B

AI summary

There is provided a technique that includes: a temperature measurer (211b) disposed in a processing space formed between substrates (1) supported by supports (35) of a substrate support (31); a detector (2111) in which the temperature measurer (211b) is provided; and a column (2112) extending in a vertical direction so as to support the detector (2111) in a horizontal direction, wherein a lower end of the detector (2111) is arranged at a same height position as a lower end of each of the supports (35) or at a higher position than the lower end of each of the supports (35), and wherein a surface of the column (2112) near the processing space is arranged farther from the processing space than a surface of a support column (34) near the processing space, the support column (34) being configured to support each of the supports (35) in the horizontal direction.