Semiconductor Module Vertical Control Terminal for Smaller Footprint
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Solution Overview
Problem
There is a demand for energy-saving, sophisticated, and smaller electronic devices, which requires improved performance and reduced size of semiconductor modules.
Innovation Solution
A semiconductor module configuration featuring a conductive substrate, semiconductor elements with switching functions, control terminals, and a sealing resin that covers the substrate and elements, with the control terminal protruding to enhance performance and reduce size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional semiconductor module configuration is used, then structural stability is maintained, but module size is large and performance is limited
Solution Approach 1:
The control terminal extends in the thickness direction (vertical dimension) rather than only in the horizontal plane, utilizing the third dimension to improve electrical connection efficiency and reduce inductance without increasing the module's footprint area. This dimensional transition allows compact packaging while enhancing performance.
Solution Approach 2:
The control terminal is integrated directly into the sealing resin structure, merging the terminal support function with the encapsulation function. This eliminates separate support structures and reduces overall module size while maintaining structural stability and electrical performance.
2Reliability
If control terminal is extended in horizontal direction, then electrical connection is improved, but module area increases
Solution Approach 1:
The control terminal transitions from horizontal extension to vertical extension in the thickness direction. This dimensional change improves electrical connection reliability by reducing inductance and enhancing contact with the semiconductor element, while simultaneously reducing the module's planar area for compact packaging.
3Volume of stationary object
If module size is reduced, then packaging efficiency is improved, but heat dissipation becomes difficult
Solution Approach 1:
The control terminal extends vertically through the sealing resin to directly contact the semiconductor element, creating a thermal conduction path in the thickness direction. This vertical thermal path enables efficient heat dissipation from the semiconductor element through the terminal structure, addressing heat management in compact modules.
Data Source
AI summary
A semiconductor module includes a conductive substrate, a semiconductor element, a control terminal, and a sealing resin. The conductive substrate has an obverse surface and a reverse surface that are spaced apart from each other in a thickness direction. The semiconductor element is electrically bonded to the obverse surface and has a switching function. The control terminal is configured to control the semiconductor element. The sealing resin has a resin obverse surface and a resin reverse surface, and covers the conductive substrate, the semiconductor element, and a part of the control terminal. The control terminal protrudes from the resin obverse surface, and extends along the thickness direction.