Vertical Terminal Semiconductor Package for Dense Low-Resistance Connections
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Solution Overview
Problem
Existing semiconductor packages face limitations in increasing the number of terminals due to bending defects and increased electrical resistance, which are exacerbated by the need for terminals to protrude and be bent for connection to a gate drive board.
Innovation Solution
A semiconductor package module with vertical terminals that penetrate a second housing, allowing for increased terminal count, reduced bending issues, and decreased electrical resistance by structurally connecting to a terminal joining unit, with a gap and different materials to minimize thermal stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If terminals are bent to connect to the gate drive board, then electrical connection is achieved, but bending defects occur and reliability is lowered
Solution Approach 1:
The patent transitions from horizontal terminal arrangement to vertical terminal arrangement, changing the spatial dimension of terminal extension. Terminals extend vertically from the upper surface of the substrate and connect to the gate drive board through via holes, eliminating the need for bending that occurs in horizontal configurations.
Solution Approach 2:
Instead of bending terminals horizontally to reach the gate drive board, the patent inverts the connection approach by having terminals extend vertically upward from the substrate surface and connect to via holes in the gate drive board, reversing the traditional bending configuration.
2Quantity of substance
If terminals come out to the side of the package housing, then connection to PCB board is achieved, but the number of terminals is limited
Solution Approach 1:
The patent utilizes the vertical dimension by having terminals extend upward from the substrate surface rather than only in horizontal directions. This vertical arrangement allows multiple terminals to be densely packed on the substrate surface, increasing the number of terminals without requiring them to come out to the sides of the package housing.
3Reliability
If terminal path is lengthened to connect semiconductor chips to PCB board, then connection is achieved, but electrical resistance increases
Solution Approach 1:
The patent shortens the electrical path by having terminals extend vertically from the substrate surface directly to via holes in the gate drive board, eliminating lengthy horizontal paths through the package housing. This vertical configuration reduces the overall length of the electrical connection path and associated resistance.
Data Source
AI summary
Provided is a semiconductor package module including vertical terminals in which the vertical terminals are connected to increase the number of terminals, problems on bending of the terminals may be solved while in electrical connection, and resistance of electrical signals may be reduced.