Vertical Terminal Power Module Packaging for High-Speed Switching
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Solution Overview
Problem
Existing power modules face challenges with signal loss during high-speed switching of silicon carbide (SiC) or gallium nitride (GaN) modules due to horizontal terminal signals, and require additional casing and assembly processes, increasing material costs and production time.
Innovation Solution
A power module design with vertically set terminals and a manufacturing method that uses an in-mold injection process to form a package body on a circuit substrate, eliminating the need for additional casing and simplifying assembly by integrating terminal racks and semiconductor components within the package body.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If horizontal terminal signals are used in traditional packaging, then the packaging structure is simple, but signal loss occurs during high-speed switching of SiC or GaN modules
Solution Approach 1:
The patent transitions from horizontal terminal arrangement to vertical terminal arrangement, changing the spatial dimension of signal transmission. This vertical configuration reduces signal path length and improves signal transmission reliability during high-speed switching of SiC or GaN modules, while the terminal rack provides structured organization to manage the increased spatial complexity.
Solution Approach 2:
The patent inverts the traditional horizontal terminal signal arrangement by implementing vertical terminal signals that protrude from the package body. This inversion resolves the signal loss issue by creating more direct signal paths from the semiconductor components to the external terminals, eliminating the need for complex horizontal routing.
2Reliability
If additional casing is provided for different types of power modules, then protection is improved, but material cost and assembly time increase
Solution Approach 1:
The patent merges the protective casing function with the package body itself. The package body is designed to provide both packaging and protection functions in a single integrated structure, eliminating the need for separate additional casing components. This reduces material cost and removes the additional assembly step, thereby improving productivity while maintaining adequate protection.
Solution Approach 2:
The package body is designed with multi-functionality, serving both as the packaging structure and as the protective casing. The external surface of the package body is configured to provide protection while also accommodating the vertical terminal arrangement, reducing the need for separate protective components and simplifying the overall structure.
3Reliability
If vertically set terminals are implemented closer to dies, then signal disparity is reduced, but manufacturing complexity increases
Solution Approach 1:
The terminal rack is pre-assembled with terminals in the vertical configuration before being mounted on the circuit substrate. This preliminary assembly allows for precise positioning of terminals closer to the semiconductor components, reducing signal disparity. The pre-assembled unit is then integrated into the package body as a single component, which manages the manufacturing complexity by modularizing the complex terminal arrangement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces signal disparity by keeping terminals closer to the semiconductor components, simplifies the assembly process, and lowers material costs by eliminating the need for additional casing, while maintaining effective protection and heat dissipation.
Implementation Method 1
performing an in-mold injection process to form a package body on the circuit substrate for packaging the semiconductor component and the terminal rack
Implementation Method 2
conducting the semiconductor component with the terminal rack by a bonding wire for an electrical conduction
Implementation Method 3
the elastic member provides an elastic force to the pressing member to make pressing member abut against and seal the jack
Data Source
AI summary
A power module, a manufacturing method, and a mold are disclosed. The power module includes a circuit substrate, a terminal assembly, and a package body. A surface of the circuit substrate is provided with at least one semiconductor component, each terminal assembly includes a terminal rack and a terminal inserted onto the terminal rack, and each terminal rack is disposed on the surface of the circuit substrate and has an insert surface and provided for passing each terminal through the insert surface into the terminal rack for combination. The package body is installed on the circuit substrate to package the semiconductor component and has an external surface substantially aligned with the insert surface of each terminal rack, or the insert surface protruding from the external surface, to make each terminal protrude out from the package body.