Vertical Terminal Semiconductor Device Insulation
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Solution Overview
Problem
Mold-type semiconductor devices face challenges in reducing size while ensuring insulation between terminals, as closely arranged high-current terminals lead to increased device size due to protrusion issues.
Innovation Solution
A semiconductor device design incorporating an insulation substrate, lead frame, semiconductor chip, mold-sealing resin, and a terminal block with a conductive terminal part and insulative base, where the terminal block is partially in contact with the mold-sealing resin to support the terminal part, allowing for integral molding and sealing while exposing the terminal outside the resin for connection, thereby maintaining insulation and reducing device size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If terminals are extended through the top face of the mold-sealing resin to ensure insulation, then insulation between terminals and heat dissipation plate is improved, but the semiconductor device size increases due to larger spacing requirements between closely arranged high-current terminals
Solution Approach 1:
The patent transitions from horizontal terminal arrangement (side-face protrusion) to vertical terminal arrangement (top-face extension), utilizing the vertical dimension to achieve insulation while maintaining compact horizontal footprint. Terminals extend through the mold-sealing resin in the vertical direction, allowing closer horizontal spacing without compromising insulation distance.
Solution Approach 2:
The mold-sealing resin serves as an intermediary insulating medium between the terminals and the heat dissipation plate. By extending terminals through this resin material, the patent achieves insulation without requiring additional insulating structures, as the resin itself provides the necessary electrical isolation.
2Area of stationary object
If terminals protrude horizontally from the side faces of the mold-sealing resin, then device size is reduced, but creeping discharges occur between the terminals and the heat dissipation plate
Solution Approach 1:
The patent eliminates horizontal protrusion by transitioning to vertical terminal extension through the top face. This dimensional change removes the geometric configuration that causes creeping discharges, as terminals no longer extend horizontally toward the heat dissipation plate where such discharges would occur.
Solution Approach 2:
The patent converts the potential harm of terminal exposure (creeping discharges) into a beneficial configuration where the vertical extension through the insulating resin actually enhances safety. The mold-sealing resin, which would normally be a barrier, becomes the pathway that safely isolates terminals while preventing discharge issues.
Data Source
AI summary
A semiconductor device and a semiconductor module which can be reduced in size while ensuing insulation are provided. In the semiconductor device, a lead frame on which a circuit pattern is formed is provided on an insulation substrate; the circuit pattern of the lead frame is joined to the back-side electrode of a semiconductor chip via a solder layer, and the lead frame is electrically connected with the top-side electrode of the semiconductor chip via a wire; the lead frame 1 includes a terminal inside a mold-sealing resin and a terminal exposed to a space outside the mold-sealing resin, and the terminal is connected to a terminal block via a solder layer; and the lead frame, the insulation substrate, the semiconductor chip and the terminal block are integrally molded and sealed by the mold-sealing resin.