Vertical Thermal Processing Apparatus Lid Coating for Particle Control
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Solution Overview
Problem
In vertical thermal processing apparatuses, particles adhere to the inner surfaces of the reaction container and lid, causing contamination during film formation processes like CVD, and require frequent manual cleaning, reducing operational efficiency.
Innovation Solution
A method and apparatus that includes a film formation process for both substrates and the inner surfaces of the reaction container, using a processing gas for substrate film formation and a distinct coating gas to form a silicon oxide film on the container and lid surfaces, fixing particles in place and preventing contamination when the lid is opened.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the lid temperature is kept low to prevent liquefaction of cleaning gas, then cleaning effectiveness is improved, but particle adhesion to the lid increases causing contamination
Solution Approach 1:
A coating film is formed on the inner surface of the lid before the cleaning process. This pre-formed coating serves as a protective layer that prevents particles from adhering to the lid during cleaning operations, while allowing the lid to maintain low temperature for effective cleaning gas operation.
Solution Approach 2:
A coating film acts as an intermediary layer between the cleaning gas environment and the lid surface. This intermediate coating prevents direct contact between particles and the lid, eliminating particle adhesion while allowing the lid to remain at low temperature for cleaning effectiveness.
2Object-affected harmful factors
If manual cleaning of the lid is performed frequently to remove particles, then contamination is reduced, but operational efficiency decreases
Solution Approach 1:
The coating film on the lid surface provides self-protection against particle adhesion. Instead of requiring frequent manual cleaning interventions, the coating enables the system to maintain cleanliness automatically during normal operation, significantly reducing maintenance burden and improving operational efficiency.
Solution Approach 2:
The coating film serves as a protective intermediary that prevents particle adhesion during normal operation, eliminating the need for frequent manual cleaning and thereby maintaining high operational efficiency while controlling contamination.
3Productivity
If the lid is opened frequently to load/unload substrates, then production throughput is maintained, but particle contamination increases due to airflow
Solution Approach 1:
The coating film is formed on the lid surface before substrate loading/unloading operations begin. This pre-formed coating creates a protective barrier that prevents particles from adhering to the lid even when the lid is opened frequently for substrate handling, allowing high throughput operation without increased contamination.
Solution Approach 2:
The coating film acts as an intermediary protective layer that decouples the lid opening operation from particle adhesion. It allows the lid to be opened frequently for substrate handling while preventing particles from adhering to the lid surface during these operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces particle contamination on substrates, decreases the need for manual cleaning, and maintains operational efficiency by immobilizing particles with a silicon oxide film, allowing for continuous operation without reducing throughput.
Implementation Method 1
a coating step of performing the film formation on a bottom portion of the vertical reaction container including an inner surface of the lid by closing the lower opening with the lid and supplying a coating gas different from the processing gas into the vertical reaction container
Data Source
AI summary
A method of performing a film formation on target substrates in a state where a substrate holder for holding the target substrates in a shelf shape is loaded into a vertical reaction container from a lower opening thereof and the lower opening is closed by a lid. The method includes: performing the film formation on the target substrates by supplying a processing gas into the reaction container; opening the lid and unloading the substrate holder from the reaction container; performing the film formation on a bottom portion of the reaction container including an inner surface of the lid by closing the lower opening with the lid and supplying a coating gas different from the processing gas into the reaction container; and performing the film formation on the target substrates by opening the lid, loading the substrate holder into the reaction container, and supplying the processing gas into the reaction container.