Vertical Thermal Plate Fixture for Simultaneous Electrical Device Testing
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Solution Overview
Problem
Traditional methods for testing electrical devices in varying thermal conditions are inadequate as they do not allow simultaneous testing of multiple devices and fail to accurately simulate edge contact scenarios, which are common in real-world deployments.
Innovation Solution
A system utilizing vertically arranged thermal plates controlled by independent controllers, allowing for simultaneous testing of multiple electrical devices with edge contact simulation, where the temperature of the plates is adjusted based on user input and characterization data to accurately replicate the thermal conditions experienced by the devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal plates are arranged horizontally to test electrical devices, then temperature control is achieved, but only single device testing is possible and edge contact scenarios are not simulated
Solution Approach 1:
The patent transitions from horizontal thermal plate arrangement to vertical arrangement, changing the spatial dimension of thermal contact. This vertical configuration enables multiple devices to be tested simultaneously while maintaining accurate edge contact simulation, as each device contacts the thermal plates at its edge surfaces rather than broad surfaces.
Solution Approach 2:
The testing system is divided into multiple independent test stations arranged vertically, each capable of testing a device independently. This segmentation allows parallel testing of multiple devices while each device experiences realistic edge contact thermal conditions similar to actual deployment scenarios.
2Reliability
If thermal plates contact the entire surface of the device, then temperature control is achieved, but real-world edge contact conditions are not replicated
Solution Approach 1:
The thermal contact is localized to the edge surfaces of the devices rather than covering the entire device surface. This local quality approach accurately replicates real-world deployment conditions where devices typically contact fixtures only at their edges, providing more realistic thermal testing without requiring complex overall configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate prediction of electrical device performance under varying thermal conditions, including edge contact scenarios, by allowing multiple devices to be tested simultaneously and ensuring precise temperature control, thereby improving the reliability of thermal testing.
Implementation Method 1
the thermal plates are arranged vertically with respect to the electrical devices under test... the electrical devices under test are subject to varying thermal conditions at the edges of the devices, including by direct contact at the edges
Data Source
AI summary
A system for testing electrical devices under varying thermal conditions is disclosed. The system includes a fixture that comprises two vertically arranged rails, into which horizontally arranged electrical devices are inserted. The rails are in contact with two thermal plates whose temperatures are controlled by controller or controllers. Target temperatures for the two thermal plates are communicated to the controller or controllers, and the electrical output of the electrical devices under test are monitored under varying thermal conditions.


