Vertical Thermal Plate Fixture for Simultaneous Electrical Device Testing

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Solution Overview

Problem

Traditional methods for testing electrical devices in varying thermal conditions are inadequate as they do not allow simultaneous testing of multiple devices and fail to accurately simulate edge contact scenarios, which are common in real-world deployments.

Innovation Solution

A system utilizing vertically arranged thermal plates controlled by independent controllers, allowing for simultaneous testing of multiple electrical devices with edge contact simulation, where the temperature of the plates is adjusted based on user input and characterization data to accurately replicate the thermal conditions experienced by the devices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If thermal plates are arranged horizontally to test electrical devices, then temperature control is achieved, but only single device testing is possible and edge contact scenarios are not simulated

Engineering Contradiction:
Improveaccuracy of thermal condition simulationVSAvoidnumber of devices tested simultaneously
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent transitions from horizontal thermal plate arrangement to vertical arrangement, changing the spatial dimension of thermal contact. This vertical configuration enables multiple devices to be tested simultaneously while maintaining accurate edge contact simulation, as each device contacts the thermal plates at its edge surfaces rather than broad surfaces.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The testing system is divided into multiple independent test stations arranged vertically, each capable of testing a device independently. This segmentation allows parallel testing of multiple devices while each device experiences realistic edge contact thermal conditions similar to actual deployment scenarios.

Inventive Principle:
Principle #1Segmentation

2Reliability

If thermal plates contact the entire surface of the device, then temperature control is achieved, but real-world edge contact conditions are not replicated

Engineering Contradiction:
Improveaccuracy of deployment condition predictionVSAvoidcomplexity of thermal contact configuration
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The thermal contact is localized to the edge surfaces of the devices rather than covering the entire device surface. This local quality approach accurately replicates real-world deployment conditions where devices typically contact fixtures only at their edges, providing more realistic thermal testing without requiring complex overall configuration.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables accurate prediction of electrical device performance under varying thermal conditions, including edge contact scenarios, by allowing multiple devices to be tested simultaneously and ensuring precise temperature control, thereby improving the reliability of thermal testing.

Implementation Method 1

the thermal plates are arranged vertically with respect to the electrical devices under test... the electrical devices under test are subject to varying thermal conditions at the edges of the devices, including by direct contact at the edges

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS8272780B1Multiple-unit thermal test apparatus for electrical devices
Publication Date: 2012.09.25 RANTEC POWER SYST
  • US8272780B1 patent drawing
  • US8272780B1 patent drawing
  • US8272780B1 patent drawing

AI summary

A system for testing electrical devices under varying thermal conditions is disclosed. The system includes a fixture that comprises two vertically arranged rails, into which horizontally arranged electrical devices are inserted. The rails are in contact with two thermal plates whose temperatures are controlled by controller or controllers. Target temperatures for the two thermal plates are communicated to the controller or controllers, and the electrical output of the electrical devices under test are monitored under varying thermal conditions.