Vertical TLVR Module Using In-Package Capacitors for AI Power Delivery
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Solution Overview
Problem
Conventional vertical power delivery modules for high-current applications in AI and ML processing units face challenges with ultra-high current demands, requiring significant decoupling capacitance and complex multi-layer structures, which complicate design and manufacturing.
Innovation Solution
The integration of Trans-Inductor Voltage Regulator (TLVR) technology in a vertical power VR module, utilizing a single-layer PCB structure and leveraging in-package capacitors of the ASIC or xPU, reduces the need for output capacitance and simplifies the design, eliminating the need for a capacitance board and layer-to-layer bonding interfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If significant decoupling capacitance is included in the VR module to meet transient performance requirements, then transient performance is improved, but device complexity and manufacturing difficulty increase due to the need for multi-layer structures
Solution Approach 1:
The patent extracts the capacitance function from the VR module itself and relocates it to the ASIC/xPU package. The VR module no longer needs to include output decoupling capacitance, as the in-package capacitors serve this function. This separation resolves the contradiction by maintaining transient performance through in-package capacitors while eliminating the complex multi-layer structure requirement in the VR module.
Solution Approach 2:
The patent introduces in-package capacitors as an intermediary element between the VR module and the load. These capacitors, located within the ASIC or xPU package, act as a buffer that provides the necessary transient response without requiring the VR module to incorporate complex multi-layer capacitance structures. The intermediary capacitors resolve the contradiction by providing transient performance support externally to the VR module.
2Reliability
If a multi-layer structure is used in the VR module to accommodate large output capacitance, then transient performance is improved, but manufacturing precision and production efficiency deteriorate
Solution Approach 1:
The patent removes the capacitance board and associated multi-layer structure from the VR module assembly. By extracting the capacitance function to in-package capacitors, the VR module becomes a simpler single-layer structure that does not require precise layer-to-layer bonding for capacitor integration, thereby improving manufacturability while maintaining transient performance through the external capacitors.
Solution Approach 2:
The patent segments the power delivery system into distinct functional components: the VR module handles voltage regulation, while the in-package capacitors handle transient response and decoupling. This segmentation allows each component to be optimized independently, with the VR module focusing on regulation simplicity and the capacitors providing transient support, thereby resolving the manufacturing precision issues associated with integrated multi-layer structures.
3Device complexity
If in-package capacitors are used as output capacitance, then device complexity is reduced, but the PCB structure must support high-current demands
Solution Approach 1:
The patent transitions from lateral power delivery to vertical power delivery architecture. By delivering power vertically from the VR module to the ASIC/xPU, the design accommodates ultra-high current demands through optimized current paths in the vertical dimension, while the in-package capacitors provide the necessary decoupling function without adding horizontal complexity to the PCB structure.
Solution Approach 2:
The patent applies local quality optimization by concentrating the capacitance function specifically within the ASIC or xPU package where it is most needed for transient response. This localized approach allows the rest of the PCB structure to be simplified, as the critical transient performance requirement is addressed at the local package level rather than requiring complex global PCB structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a more reliable, efficient, and manufacturable VR module with improved transient performance, reduced weight, and simplified electrical and mechanical components, enabling better power delivery and reduced reflow times.
Implementation Method 1
Trans-Inductor Voltage Regulator (TLVR) technology is an ultra-fast transient performance VR technology
Data Source
AI summary
The subject matter described herein provides systems and techniques for the integration of Trans-Induction Voltage regulator (TLVR) technology in a vertical power Voltage Regulator (VR) module. The capacitance inside the device to which the TLVR based vertical power VR module supplies power, rather than an output capacitance board, may be used in order to allow the module to be a single layer. In some instances, output capacitors may be integrated into components of the structures to provide adequate operational capacitance previously provided by the output capacitance board. Example structures may also include a controller.