Vertical Transient Voltage Suppressor Array with Thick Lead Frame
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Solution Overview
Problem
Avionics and mission-critical electronics face challenges from lightning-induced transients and high-power pulses, requiring effective transient voltage suppression systems that can withstand harsh environmental conditions and prevent damage from voltage transients.
Innovation Solution
A transient voltage suppression system with vertically oriented semiconductor-based solid state devices and a robust lead frame, designed to dissipate heat and resist vibration, providing fast and reliable voltage clamping without thermal failure or excessive overshoot, and capable of handling high power ratings and various voltage ranges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If transient voltage suppressors are arranged horizontally in conventional packages, then the package structure is simple, but the system cannot effectively dissipate heat and resist vibration-induced stress
Solution Approach 1:
The patent transitions from conventional horizontal arrangement of transient voltage suppressors to a vertical orientation between top and bottom surfaces of the package. This dimensional change enables improved heat dissipation through vertical thermal pathways and enhances resistance to vibration-induced stress by distributing mechanical loads along the vertical axis, thereby resolving the contradiction between reliability and structural complexity.
Solution Approach 2:
The patent employs a robust lead frame with thick leads (at least 0.015 inches) that serve dual functions: electrical connection and mechanical reinforcement. This composite structure combining electrical conductivity with mechanical strength allows the system to withstand vibration and thermal stress while maintaining electrical integrity, addressing the reliability challenge without requiring overly complex packaging.
2Loss of energy
If conventional voltage suppressor packages are used, then the device structure is simple, but the system fails to dissipate heat effectively from high-power pulses
Solution Approach 1:
The patent changes the critical parameter of lead thickness to at least 0.015 inches, which significantly increases the thermal mass and heat dissipation capability of the lead frame. This parameter change enables the system to handle high-power pulses and dissipate heat effectively, transforming the lead frame from a simple connector into an active thermal management component.
Solution Approach 2:
The robust lead frame serves multiple functions simultaneously: providing electrical connections, dissipating heat from the transient voltage suppressors, and resisting vibration-induced stress. This multi-functionality allows the system to address heat dissipation requirements without adding separate cooling components, thereby managing device complexity while improving energy loss characteristics.
3Strength
If thin leads are used in the lead frame, then the device complexity is low, but the system cannot resist vibration-induced stress on the package
Solution Approach 1:
The patent specifies a minimum lead thickness of 0.015 inches, which provides sufficient mechanical strength to resist vibration-induced stress while maintaining manufacturability. This parameter specification ensures that the lead frame can withstand harsh environmental conditions including vibration and thermal cycling, resolving the contradiction between strength requirements and device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively suppresses transient spikes, ensuring the reliability of avionics and electronics systems by dissipating pulse energy and maintaining operation under high vibration and temperature conditions, with improved thermal and mechanical performance.
Implementation Method 1
Each of the leads has a thickness of at least 0.015 inches (or 0.381 mm) in a mounting portion, in order to dissipate heat from the transient voltage suppressors
Data Source
AI summary
A system comprises a package with top and bottom surfaces, a plurality of high-power transient voltage suppressors arranged within the package, and a robust lead frame. Each of the transient voltage suppressors has first and second major surfaces substantially perpendicular to the top and bottom surfaces of the package. The lead frame comprises leads connected to the major surfaces of the transient voltage suppressors. Each of the leads has a thickness greater than about 0.015 inches (or 0.381 mm) in a mounting portion, in order to dissipate heat from the transient voltage suppressors and to resist vibration-induced stress on the package.