Vertical-Through-Via Connector for Compact 3D Chip Packaging
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Solution Overview
Problem
Existing chip packages face challenges in efficiently transmitting signals and delivering power/ground in a vertical fashion, particularly as they are scaled down to smaller dimensions.
Innovation Solution
A connector system is developed using a glass substrate with interconnection metal layers that act as vertical through vias, enabling signal transmission and power/ground delivery in a vertical fashion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If semiconductor IC chips are arranged in a two-dimensional plane on a circuit substrate, then signal transmission and power delivery can be achieved using metal traces, but the package size cannot be scaled down further due to spatial constraints
Solution Approach 1:
The patent transitions from two-dimensional planar arrangement to three-dimensional vertical stacking by introducing vertical through-via connectors that extend through the substrate thickness. Multiple IC chips are stacked vertically and interconnected through vias formed in the substrate, enabling compact packaging while maintaining signal transmission and power delivery capabilities.
2Adaptability or versatility
If vertical through vias are implemented using glass substrate with interconnection metal layers, then signal transmission and power delivery in vertical fashion are enabled, but manufacturing complexity increases
Solution Approach 1:
The vertical through-via connector is segmented into multiple functional layers: glass substrate providing mechanical support and via formation, interconnection metal layers for electrical conductivity, and insulating layers for electrical isolation. This segmentation allows each layer to be optimized and manufactured using specialized processes, facilitating vertical interconnection while managing manufacturing complexity.
3Area of stationary object
If multiple IC chips are stacked vertically, then package footprint is reduced, but signal transmission reliability in vertical direction becomes challenging
Solution Approach 1:
The patent employs composite material structures in the vertical through-via connectors, combining glass substrate with interconnection metal layers and insulating materials. This composite construction provides mechanical strength, electrical conductivity, and electrical isolation simultaneously, ensuring reliable signal transmission through the vertical stack while maintaining a reduced package footprint.
Data Source
AI summary
A connector may include: a first substrate having a top surface, a bottom surface opposite to the top surface of the top substrate and a side surface joining an edge of the top surface of the first substrate and joining an edge of the bottom surface of the first substrate; a second substrate having a top surface, a bottom surface opposite to the top surface of the second substrate and a side surface joining an edge of the top surface of the second substrate and joining an edge of the bottom surface of the second substrate, wherein the side surface of the second substrate faces the side surface of the first substrate, wherein the top surfaces of the first and second substrates are coplanar with each other at a top of the connector and the bottom surfaces of the first and second substrates are coplanar with each other at a bottom of the connector; and a plurality of metal traces between, in a first horizontal direction, the side surfaces of the first and second substrates, wherein each of the plurality of metal traces has a top end at the top of the connector and a bottom end at the bottom of the connector.