Vertical Wafer Feeding and Inserting to Reduce Breakage

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Solution Overview

Problem

Conventional horizontal wafer-separation methods in photovoltaic silicon wafer manufacturing lead to high wafer breaking rates, increasing costs and space requirements.

Innovation Solution

A vertical feeding and wafer inserting integrated machine is developed, integrating a carrying-transferring water tank, feeding unit, wafer inserting unit, and washing manipulator, which uses a primary and secondary feeding mechanism to transition wafers from vertical to horizontal, reducing breakage through a controlled feeding process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a horizontal wafer-separation method is used, then the wafer inserting process can be completed, but the wafer breaking rate increases

Engineering Contradiction:
Improvewafer inserting efficiencyVSAvoidwafer breaking rate
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent inverts the conventional horizontal wafer separation method by implementing a vertical wafer separation approach. The feeding unit conveys wafers vertically from the water tank through the conveying belt to the inserting position, and the wafer basket moves vertically to receive wafers. This vertical configuration fundamentally changes the separation direction, reducing wafer breaking rates while maintaining inserting efficiency.

Inventive Principle:
Principle #13The other way round (Inversion)

Solution Approach 2:

The patent transitions from horizontal wafer separation to vertical wafer separation by adding the vertical dimension to the conveying and inserting process. The conveying belt moves wafers in the vertical direction, and the wafer basket ascends vertically to receive wafers at different heights. This dimensional change optimizes the separating effect and reduces mechanical stress on wafers.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If multiple separate machines are used for carrying, feeding, inserting, and washing, then each function can be optimized independently, but the device complexity and space requirements increase

Engineering Contradiction:
Improvefunctional optimizationVSAvoidnumber of machines
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent merges four separate functions (carrying, feeding, inserting, and washing) into a single integrated machine. The frame body houses the water tank, feeding unit with conveying belt, wafer inserting unit with basket, and washing manipulator all in one configuration. This integration reduces the number of independent machines from four to one, simplifying the overall system while maintaining all necessary functions.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The integrated machine performs multiple functions through coordinated components: the water tank carries wafers, the feeding unit conveys them vertically, the inserting unit places them in baskets, and the washing manipulator cleans the baskets. Each component serves its specific function while contributing to the overall multi-functional capability of the single machine system.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS11915956B2Vertical feeding and wafer inserting integrated machine
Publication Date: 2024.02.27 TIANJIN HUANBO SCI & TECH CO LTD
  • US11915956B2 patent drawing
  • US11915956B2 patent drawing
  • US11915956B2 patent drawing

AI summary

The present invention provides a vertical feeding and wafer inserting integrated machine, comprising a rack and a silicon wafer transfer device provided on the rack; a carrying-transporting water tank for carrying and transporting silicon wafers is provided on one end of the rack; the rack is further provided with a feeding unit for conveying the silicon wafers in the carrying-transporting water tank to a silicon wafer transfer belt a wafer inserting unit for inserting the silicon wafers into wafer baskets is provided on one end, away from the feeding unit, of the silicon wafer transfer device, and a wafer basket arraying mechanism is provided on the other end of the wafer inserting unit; and a washing manipulator for transferring grouped wafer baskets to a washing procedure is further correspondingly provided on the rack.