Vertical Wafer Probe Holder Layout to Prevent Probe Striking
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Solution Overview
Problem
Conventional wafer probing machines face challenges in efficiently handling various wafer sizes and shapes, often resulting in inconsistent configurations that may lead to human error, debris accumulation, and increased risk of probe striking during testing.
Innovation Solution
A wafer probe device comprising a holder and a probe card, where the holder is designed to move the wafer perpendicular to the ground, allowing the probe card to probe the wafer from below, thereby improving handling efficiency and reducing the risk of debris accumulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the probe head is made larger to handle various wafer tests, then the adaptability is improved, but the weight increases and handling complexity increases
Solution Approach 1:
The patent inverts the conventional probing configuration by placing the probe card on the ground and moving the holder with the wafer upward, rather than moving the probe card downward. This inversion simplifies the mechanical structure, reduces the weight of moving components, and improves adaptability for various wafer sizes and shapes.
2Device complexity
If manual locking of the probe head is used, then the device complexity is reduced, but the reliability decreases due to human error risk
Solution Approach 1:
The holder assembly is designed to automatically carry and position the wafer without manual intervention. The system performs its own positioning and holding functions, eliminating human error while maintaining simplicity in the overall device structure.
3Ease of operation
If the probe card moves downward to probe the wafer, then the setup is simplified, but debris accumulates on the wafer causing probe striking risk
Solution Approach 1:
The patent reverses the probing direction by having the holder move upward with the wafer toward the stationary probe card on the ground. This inversion prevents debris from accumulating on the wafer surface during the probing process, eliminating the risk of probe striking while maintaining operational simplicity.
4Adaptability or versatility
If additional mechanical apparatus is required for maintenance, then the adaptability is improved, but the device complexity and loss of time increase
Solution Approach 1:
The holder assembly is designed as a multi-functional component that can handle various wafer sizes and shapes directly, eliminating the need for additional mechanical apparatus. This universal design maintains adaptability while reducing overall device complexity and maintenance requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances probing efficiency by simplifying the setup mechanism, reducing the risk of human error, and preventing debris accumulation, thus improving the overall quality and reliability of the wafer probing process.
Implementation Method 1
the holder includes a main body and a suction assembly, and the suction assembly is disposed on the main body and is movable relative to the main body, the suction assembly extends along a central axis of the holder, when the transportation module transports the wafer to the holder, the suction assembly sucks the back side of the wafer
Implementation Method 2
the holder is an electrostatic chuck, and when the electrostatic chuck sucks the wafer, a central axis of the electrostatic chuck is parallel to the ground
Data Source
AI summary
An wafer probe device is provided, including a holder, and a probe card. The holder has a holding surface for holding a wafer. The probe card has a probing side for probing the wafer. Wherein the holder and the probe card are disposed on the ground, and the holding surface of the holder and the probing side of the probe card are perpendicular to the ground. Wherein when the holder holds the wafer to move upwardly toward the probe card into a probing position, the probed surface of the wafer is in contact with the probe card, and the probe surface is perpendicular to the ground.