Vertical Wafer Treatment Layout for High-Capacity Semiconductor Processing
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Solution Overview
Problem
Conventional semiconductor processing systems occupy large floor spaces due to the horizontal arrangement of treatment units, which reduces processing capacity and increases the total floor space required, and existing solutions like positioning radiation sources next to deposition chambers lead to impermeable process windows from deposited material accumulation.
Innovation Solution
A semiconductor processing system with a vertically arranged treatment unit over a wafer handling assembly, utilizing a wafer handling robot to transfer wafers between reactors and treatment units, allowing for minimal floor space occupation while maintaining processing capacity, and using optically transparent materials for radiation permeability to avoid window impermeability issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If treatment units are arranged horizontally next to deposition chambers, then processing capacity is maintained, but floor space consumption increases
Solution Approach 1:
The treatment unit is repositioned from a horizontal arrangement next to the deposition chamber to a vertical arrangement above the wafer handling assembly. This dimensional change allows the treatment unit to utilize vertical space rather than horizontal floor space, thereby maintaining processing capacity while significantly reducing the footprint area occupied by the system
2Adaptability or versatility
If radiation sources are positioned next to deposition chambers, then treatment function is achieved, but process windows become impermeable due to deposited material accumulation
Solution Approach 1:
The treatment function is extracted from the deposition chamber environment and relocated to a separate treatment unit positioned above the wafer handling assembly. This separation removes the radiation source from the deposition chamber, preventing deposited material from accumulating on process windows and blocking radiation, while the treatment unit can still perform its function through optically transparent windows
Solution Approach 2:
The wafer handling assembly serves as an intermediary platform that enables the treatment unit to process wafers without requiring direct positioning next to the deposition chamber. The wafer is transferred to the wafer handling assembly where the treatment unit can apply radiation through transparent windows, maintaining treatment effectiveness while avoiding window contamination
3Area of stationary object
If treatment units are vertically arranged over wafer handling assembly, then floor space is reduced, but system complexity increases
Solution Approach 1:
The wafer handling assembly is designed to serve multiple functions: it acts as a transfer module for moving wafers between deposition chambers and storage, as a loadlock module for pressure transition, and as a support platform for the vertically positioned treatment unit. This multi-functionality reduces the need for separate dedicated components, thereby managing system complexity while achieving vertical integration and space reduction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively reduces floor space usage while maintaining or improving processing capacity and yield, and ensures radiation can pass through treatment windows, preventing accumulation-related issues.
Implementation Method 1
a reactor configured to deposit a film on the wafer
Implementation Method 2
a treatment unit for treating the film on the wafer
Data Source
AI summary
The present disclosure pertains to embodiments of a semiconductor processing system and method for treating a semiconductor wafer. The processing system comprises a reactor, a wafer handling assembly, and treatment unit disposed vertically adjacent to the wafer handling assembly. The system and method minimize a total floor space occupied by the system without sacrificing the processing capacity.