Vertical Web Deposition Without Hardware Contact
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Solution Overview
Problem
Conventional deposition apparatuses process substrates one side at a time, requiring double the processing time and equipment costs for two-sided deposition, and are unsuitable for fragile materials like silicon nanowires due to compressive and shear forces during high-temperature processing.
Innovation Solution
A method and apparatus that feed a web vertically through a deposition station, allowing dry deposition of materials on both sides without physical contact with hardware, using techniques like CVD and PVD, and controlling web tension and temperature to protect fragile materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional deposition apparatuses process one side at a time, then deposition quality can be maintained, but processing time doubles and equipment costs increase
Solution Approach 1:
The patent merges two separate deposition operations into a single processing pass by configuring the deposition apparatus to deposit material on both the first and second sides of the web simultaneously or sequentially in one continuous operation, thereby doubling productivity without proportionally increasing equipment complexity
Solution Approach 2:
The invention transitions from processing one side at a time (one-dimensional sequential processing) to processing both sides concurrently (two-dimensional parallel processing) by introducing dual-side deposition capability, effectively utilizing the thickness dimension of the web to enable simultaneous treatment of both surfaces
2Reliability
If the web contacts supporting surface during deposition, then temperature control and support are provided, but fragile materials like silicon nanowires experience compressive and shear forces that cause breakage
Solution Approach 1:
The patent replaces mechanical contact-based support and temperature control with non-contact methods such as radiant heating and magnetic or electrostatic suspension, eliminating compressive and shear forces that would damage fragile materials like silicon nanowires while maintaining precise temperature control and positional stability
Solution Approach 2:
The invention introduces an intermediary field (such as electromagnetic field or radiant energy) between the heating/support system and the web, allowing energy transfer and support without direct mechanical contact, thereby protecting fragile deposited materials from mechanical stress while achieving the desired temperature control
3Productivity
If the web is processed twice for two-sided deposition, then both sides receive deposition, but the first side experiences substantial compressive forces and may collapse or break
Solution Approach 1:
The patent combines two separate deposition passes into one continuous pass by equipping the apparatus with dual-side deposition capability, allowing simultaneous or sequential deposition on both web surfaces without rewinding or repositioning, thereby maintaining deposited layer integrity while improving throughput
Solution Approach 2:
The invention performs preliminary configuration of the deposition apparatus to enable dual-side deposition capability before processing begins, including positioning multiple deposition sources or configuring the web path to expose both sides to the deposition environment in sequence without mechanical contact during transfer
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient two-sided deposition in a single pass, protecting fragile materials and increasing throughput while maintaining the integrity of deposited layers.
Implementation Method 1
the ports are designed to deliver materials employed in 'dry' deposition processes such as CVD and PVD
Implementation Method 2
the ports are designed to deliver materials employed in 'dry' deposition processes such as CVD and PVD
Data Source
AI summary
Apparatuses and methods for depositing materials on both sides of a web while it passes a substantially vertical direction are provided. In particular embodiments, a web does not contact any hardware components during the deposition. A web may be supported before and after the deposition chamber but not inside the deposition chamber. At such support points, the web may be exposed to different conditions (e.g., temperature) than during the deposition. Also provided are substrates having materials deposited on both sides that may be fabricated by the methods and apparatuses.


