Vertical Wire Bond Layout for Smaller Semiconductor Contact Fingers
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Solution Overview
Problem
The increasing demand for high-capacity portable consumer electronics necessitates maximizing semiconductor die size within a given form factor, but conventional side-by-side wire bonding on contact fingers occupies valuable space, hindering storage capacity expansion.
Innovation Solution
The implementation of vertically formed wire bonds on substrate contact fingers allows for a reduction in contact finger size, enabling larger semiconductor dies by consolidating bond wires into a single column, thereby freeing up space for increased die size or performance enhancements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate side-by-side wire bonds are formed on contact fingers, then electrical connectivity is achieved, but contact finger area increases reducing available space for semiconductor dies
Solution Approach 1:
The patent transitions wire bond arrangement from a two-dimensional side-by-side layout to a three-dimensional vertical column structure. Multiple wire bonds are stacked vertically along the contact finger, utilizing the Z-dimension to reduce the footprint area occupied by wire bonds while maintaining all necessary electrical connections.
Solution Approach 2:
The patent consolidates multiple separate wire bonds that would traditionally be placed side-by-side into a single vertical column structure. This merging approach allows multiple bond wires to share the same contact finger location, effectively reducing the total area required for wire bonding while maintaining electrical connectivity to multiple semiconductor dies.
2Area of moving object
If contact finger area is reduced to accommodate larger semiconductor dies, then storage capacity increases, but space for wire bonds decreases
Solution Approach 1:
By stacking wire bonds vertically in the third dimension, the patent enables larger semiconductor dies to be placed on the substrate without increasing contact finger area. The vertical arrangement accommodates more wire bonds within the same footprint, allowing expanded die area for increased storage capacity.
Solution Approach 2:
The patent implements a nested arrangement where multiple wire bonds are positioned within a vertical column structure along the contact finger. This nesting allows wire bonds to be arranged in a compact configuration, freeing up substrate area for larger semiconductor dies while maintaining all necessary electrical connections.
3Reliability
If multiple wire bonds are placed side-by-side on individual contact fingers, then electrical connections to multiple dies are achieved, but valuable package space is consumed
Solution Approach 1:
The patent utilizes the vertical dimension to stack multiple wire bonds along contact fingers instead of placing them side-by-side in two dimensions. This three-dimensional arrangement significantly reduces the footprint area occupied by wire bonds, freeing up valuable package space for larger semiconductor dies and increased storage capacity.
Solution Approach 2:
The patent merges multiple wire bond functions into a consolidated vertical column structure along each contact finger. This approach maintains electrical connections to multiple semiconductor dies while reducing the total area consumed by wire bonding, thereby increasing the space available for active storage elements.
Data Source
AI summary
A semiconductor device includes a vertical column of wire bonds on substrate contact fingers of the device. Semiconductor dies are mounted on a substrate, and electrically coupled to the substrate such that groups of semiconductor dies may have bond wires extending to the same contact finger on the substrate. By bonding those wires to the contact finger in a vertical column, as opposed to separate, side-by-side wire bonds on the contact finger, an area of the contact finger may be reduced.