Automated Height Measurement of Vertical Wire Interconnections
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Solution Overview
Problem
Manual visual inspection of vertically-oriented wire interconnections on semiconductor substrates is inconsistent and prone to human error, lacking precision in detecting defects and measuring heights within acceptable ranges.
Innovation Solution
An automated method involving a visual inspection apparatus with a camera and processor to capture top views, locate the tip end of vertical wire interconnections, and use a conductive probe to determine the contact height, which corresponds to the wire interconnection height, ensuring accurate and repeatable measurements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If manual visual inspection is used to detect wire interconnection defects, then the inspection process is simple to implement, but the inspection precision and consistency deteriorate due to human error
Solution Approach 1:
The patent replaces manual visual inspection with an automated optical inspection system that uses a camera to capture images of wire interconnections and processes them through image analysis algorithms. This substitution eliminates human error while maintaining ease of implementation through automated defect detection and height measurement.
Solution Approach 2:
The patent creates an optical copy (image) of the wire interconnection structure and analyzes this copy to determine defect presence and height measurements. The image processing system captures visual information and uses algorithmic analysis to extract precise measurements, replacing direct human observation with automated image-based measurement.
2Measurement precision
If automated optical inspection is used to measure wire heights, then the measurement precision improves, but the device complexity increases due to additional equipment requirements
Solution Approach 1:
The patent makes the optical inspection system multi-functional by enabling it to perform both defect detection and height measurement tasks using the same camera and image processing platform. This universality allows the system to achieve precise height measurements without requiring separate dedicated measurement equipment, thereby controlling device complexity.
Solution Approach 2:
The patent introduces an intermediary reference plane (such as the substrate surface or bond pad) that serves as a baseline for height measurements. By measuring the distance from this reference plane to the wire interconnection, the system achieves accurate height measurements through a standardized intermediary reference point, simplifying the measurement process.
3Reliability
If automated inspection systems are implemented, then the inspection consistency improves, but the device complexity and initial implementation difficulty increase
Solution Approach 1:
The patent implements feedback mechanisms where the image processing system continuously analyzes wire interconnection images and provides real-time defect detection and height measurement results. This feedback loop ensures consistent inspection quality by automatically comparing measurements against predefined criteria and providing standardized evaluation outcomes.
Solution Approach 2:
The patent performs preliminary actions by establishing reference planes and calibration data before actual inspection begins. The system pre-processes reference images of the substrate surface and bond pads to create baseline data for subsequent height measurements, ensuring consistent and repeatable inspection results across multiple measurements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Provides an automated, accurate, and objective inspection method for detecting deviations and measuring heights of vertical wire interconnections, reducing human error and ensuring compliance with manufacturing tolerances.
Implementation Method 1
lowering the conductive probe towards the vertical wire interconnection until an electrical connection is made between the conductive probe and the tip end of the vertical wire interconnection
Data Source
AI summary
A height of a vertical wire interconnection bonded onto a substrate is measured by first capturing a top view of the vertical wire interconnection and identifying a position of a tip end of the vertical wire interconnection from the top view. A conductive probe is located over the tip end of the vertical wire interconnection, and is lowered towards the vertical wire interconnection until an electrical connection is made between the conductive probe and the tip end of the vertical wire interconnection. A contact height at which the electrical connection is made may thus be determined, wherein the contact height corresponds to the height of the vertical wire interconnection.