Vertically Oriented PCM Memory Structure

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Solution Overview

Problem

Conventional horizontally constricted phase-change memory (PCM) cells occupy large areas due to their layout, limiting efficiency and density in memory devices.

Innovation Solution

A method for fabricating vertically oriented PCM memory structures by forming pillars with a dumbbell shape using phase-change material, where spacers are processed to create a vertical bridge connecting the ends of the pillars, reducing area consumption and enhancing efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If horizontally constricted PCM cells are used, then the memory cell structure is simple to fabricate, but the area occupied by each memory cell is large

Engineering Contradiction:
Improvearea occupied by memory cellVSAvoidfabrication process complexity
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

The patent transitions from a horizontal constraint configuration to a vertical constraint configuration by forming the dumbbell-shaped pillar structure extending vertically between upper and lower electrodes. This dimensional change from horizontal to vertical orientation reduces the planar area footprint of each memory cell while maintaining the essential functional structure, thereby increasing memory device density without proportionally increasing fabrication complexity

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If vertically oriented dumbbell-shaped pillars are formed, then memory device density is increased, but the fabrication process becomes more complex

Engineering Contradiction:
Improvememory device densityVSAvoidfabrication process complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The fabrication process is segmented into distinct stages: forming the initial pillar structure, depositing spacers on sidewalls, selectively removing spacer portions, and recessing the pillar to create the dumbbell shape. This segmentation of the complex fabrication process into manageable sequential steps enables the creation of high-density vertically oriented structures while maintaining process control and manufacturability

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Spacers are deposited on the sidewalls of the pillar structure before the final recessing step. This preliminary action of placing spacers provides a protective mask during selective removal processes and defines the geometry of the final dumbbell-shaped structure, enabling precise control over the vertical constraint configuration before the actual pillar recessing occurs

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The vertically oriented PCM cells increase efficiency and reduce area usage compared to horizontally constricted cells, enabling higher density and performance in memory devices.

Implementation Method 1

PCM can exploit semiconducting properties of phase-change materials, such as, e.g., chalcogenide glass, that include amorphous and crystalline phases. Information can be stored in the amorphous and crystalline phases, which can be reversibly switched by applying an external voltage.

Methodology Applied
Scientific EffectPhase change: Phase Change

Implementation Method 2

Forming the modified pillar includes removing the second spacer using a wet etch process, and recessing the PCM material to have the vertically oriented dumbbell shape

Methodology Applied
Scientific EffectWet etch:

Data Source

PatentUS10903422B2Vertically oriented memory structure
Publication Date: 2021.01.26 INTERNATIONAL BUSINESS MACHINE CORPORATION
  • US10903422B2 patent drawing
  • US10903422B2 patent drawing
  • US10903422B2 patent drawing

AI summary

A method for fabricating a semiconductor device including a vertically oriented memory structure includes forming at least one pillar including phase-change memory (PCM) material on at least one electrode, forming a plurality of spacers on the electrode and along sidewalls of the pillar, and forming, by processing the plurality of spacers and the pillar, a modified pillar having a vertically oriented dumbbell shape associated with a vertically oriented PCM memory structure.