Vessel-Wall Temperature Sensor Assembly With Decoupled Thermal Paths
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Solution Overview
Problem
Existing non-intrusive process temperature measurement assemblies face challenges in achieving accurate, reliable, and fast responding surface temperature measurements due to variations in thermal coupling and resistance, which are influenced by ambient conditions and manufacturing inconsistencies.
Innovation Solution
A temperature sensor assembly with a first and second single-branched thermal conduction path, where the temperature measurement sensor has a stronger thermal coupling to the vessel wall than the reference sensor, is used to stabilize thermal resistance and improve measurement accuracy by decoupling the thermal paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If insulation around the probe tip is used to shield the exterior surface from ambient conditions, then measurement stability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent extracts the thermal coupling function from the complex insulated structure and implements it through a simplified thermal conduction path. By removing the need for extensive insulation and focusing on the essential thermal coupling mechanism, the design achieves measurement stability without the complexity of traditional insulated probe structures.
Solution Approach 2:
The patent introduces a thermal conduction path as an intermediary element that mediates between the temperature sensor and the vessel wall. This thermal conduction path serves as a controlled thermal coupling mechanism, eliminating the need for complex insulation while maintaining measurement stability through defined thermal resistance characteristics.
2Measurement precision
If thermal coupling strength is increased to improve measurement accuracy, then measurement precision is improved, but thermal interference from ambient conditions increases
Solution Approach 1:
The patent applies local quality by creating different thermal coupling characteristics at different locations within the thermal conduction path. The coupling to the vessel wall is optimized for measurement accuracy, while the ambient thermal coupling is controlled and minimized through the specific design of the thermal conduction path geometry and material properties.
Solution Approach 2:
The patent utilizes parameter changes by adjusting the thermal resistance values of the thermal conduction path. By controlling the thermal coupling strength through parameter selection (material properties, geometry dimensions), the system achieves optimal measurement precision while maintaining resistance to ambient thermal interference.
3Reliability
If multiple temperature sensors with different thermal coupling are used to compensate for ambient effects, then measurement reliability is improved, but device complexity increases
Solution Approach 1:
The patent merges the functions of multiple sensors into a single integrated temperature sensor assembly. By combining the temperature sensing function with the thermal conduction path structure, the design achieves reliable temperature measurement without requiring separate reference sensors and complex multi-sensor assemblies.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the reproducibility and durability of temperature measurements by minimizing thermal interference, ensuring accurate and stable surface temperature determination.
Implementation Method 1
a first single-branched thermal conduction path, between the surface of the vessel wall and an environment of the temperature sensor assembly, with a temperature measurement sensor
Implementation Method 2
configured to be thermally coupled to a first site of the surface of the vessel wall resulting in a first thermal resistance
Data Source
AI summary
A temperature sensor assembly configured to be coupled thermally to a vessel wall for determining a temperature of a surface of the vessel wall is provided, the assembly includes: a first single-branched thermal conduction path, between the surface of the vessel wall and an environment of the temperature sensor assembly, comprising a temperature measurement sensor, configured to be thermally coupled to a first site of the surface of the vessel wall resulting in a first thermal resistance; and a second single-branched thermal conduction path, between a second site of the surface of the vessel wall and an environment of the temperature sensor assembly, comprising a reference temperature sensor, configured to be thermally coupled to the surface of the vessel wall resulting in a second thermal resistance.