Polyimide Fixing Belt with VGCF for Thermal Conductivity
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Solution Overview
Problem
Existing electrophotographic imaging apparatuses face challenges in achieving high-speed printing and low-energy fixing methods due to the limitations of traditional fixing belts in terms of heat capacity, thermal conductivity, crack resistance, and image quality.
Innovation Solution
A fixing belt with a polyimide substrate layer incorporating vapor grown carbon fibers (VGCF) as a thermally conductive filler, combined with a release layer and an elastic layer, is used to enhance thermal conductivity, crack resistance, and image quality, allowing for efficient high-speed printing and low-energy fixing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If traditional fixing belts are used, then the structure is simple and easy to manufacture, but the thermal conductivity is low and crack resistance is poor
Solution Approach 1:
The fixing belt uses a composite structure consisting of a polyimide substrate layer containing vapor grown carbon fibers (VGCF) for enhanced thermal conductivity and crack resistance, combined with a release layer and an elastic layer. This composite material approach resolves the contradiction by integrating multiple materials with complementary properties to achieve both high strength/thermal conductivity and a manageable structural complexity.
2Temperature
If traditional fixing belts are used, then the manufacturing process is simple, but the thermal conductivity is insufficient for high-speed printing
Solution Approach 1:
The polyimide substrate layer incorporates vapor grown carbon fibers (VGCF) as a thermally conductive filler to achieve high thermal conductivity necessary for high-speed printing. The composite material structure allows heat to be efficiently distributed across the belt surface while maintaining compatibility with existing manufacturing processes for forming and curing the polyimide matrix.
3Productivity
If the fixing belt operates at high speed, then productivity increases, but the heat capacity requirements increase leading to higher energy consumption
Solution Approach 1:
The fixing belt utilizes vapor grown carbon fibers (VGCF) with high thermal conductivity to rapidly distribute heat across the belt surface. This parameter change in thermal conductivity allows the belt to achieve the required heat capacity for high-speed printing more efficiently, reducing energy consumption by minimizing heat loss and achieving uniform temperature distribution faster.
4Use of energy by moving object
If the fixing belt operates at low energy, then energy consumption decreases, but the image quality may deteriorate
Solution Approach 1:
The composite structure with VGCF-filled polyimide substrate layer provides high thermal conductivity that enables uniform and rapid heat distribution across the fixing belt surface. This ensures consistent toner fusion and high image quality even at lower energy consumption levels, as the efficient heat transfer prevents localized overheating or insufficient heating zones.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed fixing belt achieves high thermal conductivity, improved crack resistance, and extended lifespan, enabling efficient operation in high-speed printing and low-energy fixing methods while maintaining image quality.
Implementation Method 1
A fixing belt with a polyimide substrate layer incorporating vapor grown carbon fibers (VGCF) as a thermally conductive filler, combined with a release layer and an elastic layer, is used to enhance thermal conductivity
Data Source
AI summary
A fixing belt includes a substrate layer inducting a first base resin and a first thermally conductive filler dispersed in the first base resin; and a release layer provided on the substrate layer, wherein the first base resin includes at least one selected from a polyimide, a polyamide, and a polyamideimide and the first thermally conductive filler includes at least one selected from carbon black, graphite, boron nitride (BN), carbon nanotubes (CNTs), and carbon fibers, and the substrate layer has a thermal conductivity in a thickness direction of about 1.5 W/m·K or more.