3D Via Antenna for Microwave Radar Package Bandwidth
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Solution Overview
Problem
Existing microwave antenna packages face limitations in operating bandwidth, radiation patterns, and gain, particularly for long-range and medium-range radar applications, due to narrow bandwidth and parasitic radiation issues in fan-out wafer level packaging technologies.
Innovation Solution
A microwave antenna apparatus and package that incorporate a semiconductor package module with a larger antenna module, featuring an antenna substrate, feed layer, and ground layer, which is separately fabricated and integrated using a pick and place process, allowing for heterogeneous integration and improved signal coupling through magnetic or electromagnetic means.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If planar antenna structures are printed on redistribution layers in fan-out wafer level packages, then system integration is achieved, but operating bandwidth becomes narrow (1-5%)
Solution Approach 1:
The patent transitions from planar 2D antenna structures printed on redistribution layers to three-dimensional antenna structures formed within through-package vias. This dimensional change enables broader operating bandwidth by creating resonant cavities and multi-mode radiation patterns that are not achievable with planar structures alone.
Solution Approach 2:
The patent embeds antenna elements directly within the through-package via structures, nesting the antenna functionality inside the existing packaging infrastructure. This allows the antenna to utilize the via cavity for resonance while maintaining compact integration within the package footprint.
2Reliability
If planar antenna structures are used in fan-out wafer level packages, then integration is achieved, but radiation patterns become distorted due to thick mold compound
Solution Approach 1:
The patent extracts the antenna radiation function from the planar redistribution layer and relocates it to three-dimensional via structures that extend through the mold compound. This positioning the antenna elements at or near the package surface, where they can radiate more effectively without being obscured by thick mold compound.
Solution Approach 2:
By forming antenna elements in the vertical dimension within through-package vias rather than on planar surfaces, the patent creates radiation paths that are less affected by the horizontal thickness of the mold compound, improving pattern integrity.
3Object-generated harmful factors
If planar antenna structures are printed on redistribution layers, then packaging is simplified, but parasitic radiation to all directions increases
Solution Approach 1:
The patent concentrates the antenna radiation function in localized three-dimensional via structures rather than distributed planar elements. This localization allows for better control of radiation patterns and reduced parasitic radiation in unwanted directions through strategic placement and grounding of via structures.
4Power
If planar antenna structures are used, then manufacturing is simpler, but gain is insufficient for long range and medium range radar applications
Solution Approach 1:
The patent forms three-dimensional antenna structures within through-package vias, creating resonant cavities that support multiple radiation modes and higher gain patterns compared to planar structures. The vertical dimension enables dipole and monopole radiation patterns with superior gain characteristics for radar applications.
Solution Approach 2:
The patent utilizes composite structures combining conductive via materials with dielectric mold compound to create resonant antenna elements. This composite approach enables high-gain radiation patterns while maintaining manufacturing compatibility with standard packaging processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances beam width control, gain, and radiation patterns, enabling the integration of various antenna types and reducing parasitic radiation, thus addressing the limitations of existing technologies and facilitating more efficient system integration.
Implementation Method 1
The antennas may be fed by means of a through package via or a coupling block. The coupling block may have different transmission lines or vias to couple the signals through magnetic or electromagnetic coupling.
Implementation Method 2
The coupling block may have different transmission lines or vias to couple the signals through magnetic or electromagnetic coupling.
Data Source
AI summary
A microwave antenna apparatus comprises a semiconductor package module comprising a mold layer, a semiconductor element, a coupling element and a redistribution layer, and an antenna module mounted on top of the semiconductor package module, said antenna module comprising an antenna substrate, one or more antenna elements, an antenna feed layer and an antenna ground layer. The footprint of the antenna module is larger than the footprint of the semiconductor package module.