Interconnection structure with anti-adhesion layer
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Solution Overview
Problem
The challenge in semiconductor manufacturing is the adhesion of etching byproducts to inner surfaces during the formation of via and trench openings, which can lead to reduced feature sizes and compromised device performance.
Innovation Solution
An anti-adhesion layer is conformally deposited on the inner surfaces of the recess to prevent the adhesion of etching byproducts, ensuring precise control over the dimensions of via and trench openings by using materials with different adhesion properties from the dielectric structure, thereby protecting the liner layer and maintaining the integrity of the openings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If etching process is performed to form via and trench openings, then openings are formed through the dielectric structure, but etching byproducts adhere to inner surfaces causing reduced feature sizes
Solution Approach 1:
An anti-adhesion layer is deposited on the inner surfaces of the recess to serve as an intermediary between the etching byproducts and the dielectric structure. This layer prevents direct adhesion of byproducts to the opening walls, thereby maintaining the intended feature dimensions and preventing size reduction during subsequent etching operations.
Solution Approach 2:
The anti-adhesion layer is deposited in advance before the etching process that forms the via and trench openings. This preliminary action prepares the surfaces with low adhesion properties, ensuring that when etching byproducts are generated, they will not adhere to the opening walls and cause dimensional inaccuracies.
2Manufacturing precision
If anti-adhesion layer is deposited on inner surfaces, then adhesion of etching byproducts is prevented, but additional process step is added
Solution Approach 1:
The anti-adhesion layer changes the surface energy parameters of the inner walls, transforming them from high adhesion to low adhesion surfaces. This parameter change prevents byproduct adhesion without requiring complex process modifications, as the layer can be deposited using standard thin film deposition techniques.
3Ease of manufacture
If conventional etching is performed without anti-adhesion layer, then process is simpler, but feature size accuracy is compromised
Solution Approach 1:
The anti-adhesion layer acts as a disposable protective coating that is deposited, performs its function during etching, and can be subsequently removed or remains as a thin residual layer. This inexpensive, single-use layer protects the critical dimensions without requiring complex or expensive process modifications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The anti-adhesion layer effectively prevents the reduction in opening sizes due to etching byproducts, ensuring accurate feature formation and enhancing device performance by maintaining the intended dimensions and reducing unwanted etching of underlying structures.
Implementation Method 1
An anti-adhesion layer is conformally deposited on the inner surfaces of the recess to prevent the adhesion of etching byproducts
Implementation Method 2
an anti-reflection layer 108 is formed on the dielectric structure 106
Data Source
AI summary
A device comprises a non-insulator structure, a dielectric layer, a metal via, a metal line, and a dielectric structure. The dielectric layer is over the non-insulator structure. The metal via is in a lower portion of the dielectric layer. The metal line is in an upper portion of the dielectric layer. The dielectric structure is embedded in a recessed region in the lower portion of the dielectric layer. The dielectric structure has a tapered top portion interfacing the metal via.