Via-Array Heat Dissipation Path for Thin Electronic Enclosures

The patent transitions from planar heat transfer bodies to three-dimensional via structures that extend vertically through the substrate layers. The via array creates a volumetric heat dissipation path rather than a surface-level path, increasing the effective cross-sectional area for heat transfer in the stacking direction without increasing the device footprint.

The heat-dissipating path is segmented into multiple via structures arranged in an array, where each via acts as an independent heat transfer channel. This segmentation allows the total heat dissipation capacity to be distributed across multiple parallel paths, effectively increasing the overall cross-sectional area available for heat transfer.

The patent merges the heat dissipation function with the existing substrate structure by integrating via arrays directly into the multilayer substrate. This eliminates the need for separate heat-dissipating sheets or additional thermal management components, as the substrate itself becomes the heat transfer medium through the via structures.

The via structures serve dual functions: they provide electrical connections between layers and simultaneously act as heat dissipation pathways. This multi-functionality eliminates the need for dedicated heat dissipation components, reducing overall device complexity while maintaining effective thermal management.