Via-Array Laminated Waveguide for Low-Loss Millimeter-Wave Transmission
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Solution Overview
Problem
Existing waveguide structures experience significant conductor loss in high-frequency bands due to the skin effect, leading to increased transmission loss in millimeter waves and terahertz waves.
Innovation Solution
A waveguide design with a laminated substrate and through-vias arrayed in specific orientations to reduce conductor loss, featuring a first via group and a second via group disposed orthogonally to the electric field direction, with spacings equal to or less than half the wavelength, minimizing current flow around the waveguide.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vias are arranged around the opening to form a metal waveguide structure, then leakage of electromagnetic wave is suppressed, but conductor loss increases due to current flowing through surrounding through conductors
Solution Approach 1:
The patent extracts and removes the through-vias from the high-frequency signal path. By configuring vias to connect only ground layers without penetrating the signal-containing conductor layers, the design eliminates the harmful current flow through vias that causes conductor loss, while still maintaining electromagnetic wave containment through the remaining via structure
Solution Approach 2:
The patent segments the via structure into different functional groups: signal vias that connect conductor layers for signal transmission, ground vias that connect ground layers for reference potential, and isolation vias that provide electromagnetic shielding. This segmentation allows each via type to be optimized for its specific function, reducing overall conductor loss while maintaining waveguide integrity
2Reliability
If multiple through-vias are arranged around the opening to suppress electromagnetic wave leakage, then waveguide performance improves, but the number of vias increases leading to higher manufacturing complexity
Solution Approach 1:
The patent makes the via structure multi-functional by having vias serve multiple purposes: containing electromagnetic waves, providing ground reference, and enabling signal transmission. The same via array configuration achieves waveguide containment while the selective connection scheme (connecting only certain layers) reduces the total via count and simplifies manufacturing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed waveguide structure effectively reduces conductor loss in high-frequency bands, enhancing signal transmission efficiency and reducing manufacturing costs by optimizing via placement and arrangement.
Implementation Method 1
a first through-via group of a plurality of first through-vias electrically connecting between the plurality of first conductor layers, the plurality of first through-vias being linearly arrayed in an in-plane direction of the first laminated substrate at a spacing equal to or less than a half wavelength of an electromagnetic wave propagating through the waveguide
Implementation Method 2
in frequency bands of millimeter waves, terahertz waves, and the like, the transmission loss due to conductor loss increases due to an influence of the skin effect and interface unevenness
Data Source
AI summary
This waveguide comprises: a first multilayered board in which a first dielectric layer and a plurality of first conductive layers the latter of which has a first opening are stacked; a first through via group in which a plurality of first through vias for electrically connecting the first conductive layers are aligned, in an in-plane direction of the first multilayered board, at intervals that are equal to or less than the one-half wavelength of an electromagnetic wave that is to be caused to propagate through the waveguide; and a second through via group in which a plurality of second through vias for electrically connecting the first conductive layers are aligned at said intervals in the in-plane direction. The waveguide does not have any through vias other than the plurality of first through vias and the plurality of second through vias. The first through via group and the second through via group are arranged, in the in-plane direction, in a direction orthogonal to the direction of the electric field of signals propagating in the thickness direction of the first multilayered board and are opposed to each other with the first opening therebetween.