Electronic Component Via Conductor Dicing Load Reduction
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Solution Overview
Problem
The conventional electronic components face issues during the dicing process due to the hard columnar electrodes, which increase the cutting load, leading to potential peeling, blade damage, and increased stress on the dicing blade.
Innovation Solution
The electronic component design incorporates a via conductor with a smaller exposure width than the columnar electrode, reducing the area of the columnar electrode on the end surface, thereby decreasing the cutting load and preventing peeling by dispersing the via conductors to distribute the load more evenly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the columnar electrode is made of Cu and extends from the lead-out electrode to the upper surface while being exposed from the end surface, then the electrical connection is improved, but the cutting load increases during dicing
Solution Approach 1:
The patent segments the columnar electrode structure by introducing a via conductor portion that is recessed from the end surface, separating the exposed columnar electrode into two distinct parts: the via conductor embedded in the element body and the columnar electrode extending to the upper surface. This segmentation reduces the continuous exposed area of hard material at the cutting surface, thereby reducing cutting load while maintaining electrical connection integrity through the via conductor pathway.
2Strength
If the area of the columnar electrode on the end surface is increased, then the electrical connection strength is improved, but the columnar electrode may peel from the element body due to heat or physical impact during cutting
Solution Approach 1:
The via conductor is embedded within the element body and provides a cushioning effect by absorbing thermal and mechanical stresses before they reach the columnar electrode. The recessed via conductor structure acts as a stress buffer zone, preventing direct transmission of cutting-induced heat and physical impact to the full extent of the columnar electrode, thereby preventing peeling while maintaining connection strength.
3Ease of manufacture
If the columnar electrode is directly connected to the lead-out electrode without a via conductor, then the manufacturing process is simplified, but the cutting load increases and blade damage may occur
Solution Approach 1:
The via conductor serves as an intermediary structure between the lead-out electrode and the columnar electrode. This intermediary element, embedded in the element body with a recessed configuration, mediates the mechanical and thermal stresses during cutting, protecting the dicing blade from direct contact with the full extent of hard material, thereby preventing blade clogging, cracking, and wear while maintaining electrical connectivity.
4Force
If the exposure width of the via conductor is made smaller than the columnar electrode, then the cutting load is reduced, but the manufacturing precision requirements increase
Solution Approach 1:
The patent specifies that the exposure width of the via conductor along the second direction should be 0.1 mm or less, transforming a qualitative design requirement into a quantitative parameter control. This parameter specification enables precise control of the via conductor exposure width during manufacturing, ensuring that the reduced exposure area sufficiently lowers cutting load while providing clear manufacturing targets for quality control and inspection.
Data Source
AI summary
An electronic component comprising an element body including opposite first and second end surfaces, and an upper surface connecting the first and second end surfaces; a circuit element embedded in the element body; a first lead-out electrode embedded on the first end surface side and electrically connected to the circuit element; a columnar electrode arranged separately from the first lead-out electrode in a first direction viewed in a direction orthogonal to the first end surface, and embedded in the element body with a portion exposed from the first end surface to the upper surface; and a first via conductor connecting the first lead-out and columnar electrodes. An exposure width of the first via conductor, on the first end surface along a second direction orthogonal to the first direction viewed in the direction orthogonal to the first end surface, is smaller than the exposure width of the columnar electrode.