Via Conductor Group Layout for Heat Management

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Solution Overview

Problem

The increasing demand for compact electronic devices leads to heat concentration and deformation issues due to densely packed via conductors, potentially causing contact failures between electronic components and substrates over long-term use.

Innovation Solution

An electronic component mounting substrate with a rectangular insulating substrate featuring non-overlapping first and second via conductor groups, where the second via conductors are more numerous and located between the mounting portion and the first via conductors, preventing heat concentration and deformation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If via conductors are densely packed to enhance functionality, then the functionality and integration density are improved, but heat concentration and deformation occur causing reliability deterioration

Engineering Contradiction:

ImprovefunctionalityVSAvoidcontact reliability

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The via conductors are divided into multiple groups (first via conductor groups and second via conductor groups) that are spatially separated and do not overlap in plan view. This segmentation prevents heat concentration by distributing the via conductors across different regions, allowing each group to function independently while maintaining overall connectivity, thus resolving the contradiction between high functionality and reliability

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent transitions from a two-dimensional dense packing arrangement to a three-dimensional distributed arrangement where via conductors are organized in multiple groups at different positions. By utilizing the spatial distribution in multiple dimensions rather than concentrating via conductors in a single plane, the design achieves both high functionality through multiple connection paths and reliability through heat dissipation and deformation prevention

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Productivity

If via conductors are densely provided to increase connectivity, then the connectivity is improved, but heat deviation occurs causing substrate deformation

Engineering Contradiction:

ImproveconnectivityVSAvoidsubstrate stability

Core Design Contradiction:

ProductivityVSStability of the object's composition

Solution Approach 1:

Different regions of the substrate are assigned different via conductor group configurations. The first via conductor groups and second via conductor groups are positioned in distinct locations with specific spacing relationships, creating local variations in heat distribution patterns. This local quality approach allows high connectivity in each region while preventing overall heat concentration that would cause substrate deformation

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The mounting portion serves as an intermediary element positioned between the first via conductor groups and second via conductor groups. This intermediary structure helps distribute and isolate heat from different via conductor groups, preventing heat accumulation and maintaining substrate stability while preserving the connectivity function of the via conductors

Inventive Principle:

Principle #24Intermediary (Mediator)

3Area of stationary object

If via conductors are overlapped in plan view to save space, then the space utilization is improved, but heat concentration causes contact failure

Engineering Contradiction:

Improvespace utilizationVSAvoidheat concentration

Core Design Contradiction:

Area of stationary objectVSObject-affected harmful factors

Solution Approach 1:

The via conductor groups are arranged in a nested hierarchical structure where first via conductor groups and second via conductor groups are positioned at different spatial levels and orientations. This nesting approach maximizes space utilization by efficiently packing via conductor groups throughout the substrate volume while maintaining sufficient spacing between groups to prevent heat concentration and contact failure

Inventive Principle:

Principle #7Nested doll (Nesting)

Data Source

PatentUS10985098B2Electronic component mounting substrate, electronic device, and electronic module

Publication Date: 2021.04.20 KYOCERA CORP

AI summary

An electronic component mounting substrate includes an insulating substrate having a rectangular shape in a plan view of the electronic component mounting substrate, the insulating substrate including a mounting portion on a principal face thereof for mounting an electronic component; and first via conductor groups each including first via conductors and second via conductor groups each including second via conductors, the first via conductors and the second via conductors penetrating through the insulating substrate in a thickness direction thereof, a number of the second via conductors being larger than that of the first via conductors, the mounting portion, the first via conductor groups, and the second via conductor groups being disposed so as not to overlap each other in a transparent plan view of the electronic component mounting substrate, the first via conductor groups being located between the mounting portion and the second via conductor groups, respectively.