Via Conductor Positioning for Circuit Module Stress Relief
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Solution Overview
Problem
Miniaturization of circuit modules for mobile terminals leads to stress concentration on mounting electrodes, causing breaks, chips, or peeling, which can result in failure due to external impacts and thermal changes.
Innovation Solution
Incorporating via conductors connected to mounting electrodes closer to the center of the circuit substrate and an insulation layer covering the mounting electrodes and via conductors, which reduces stress concentration and prevents peeling, thereby maintaining electrical characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If miniaturization of circuit modules is advanced to reduce size, then the size of circuit modules is reduced, but stress concentration occurs in mounting electrodes leading to breakage, chipping, or peeling
Solution Approach 1:
The invention moves the via conductor from the corner portion (2D position) to the center portion of the mounting electrode, changing its spatial dimension within the electrode. This dimensional repositioning allows the via conductor to act as a stress distribution center, preventing stress concentration at the corners while maintaining the miniaturized module size.
Solution Approach 2:
The via conductor is pre-positioned at the center of the mounting electrode during manufacturing, before any stress or impact occurs. This preliminary placement ensures that the via conductor is already in the optimal position to distribute stress uniformly across the electrode when external forces are applied, preventing breakage, chipping, or peeling.
2Strength
If corner portions of mounting electrodes are chamfered to prevent breakage, then stress resistance is improved, but manufacturing complexity increases
Solution Approach 1:
The invention extracts the stress concentration problem from the corner portions of the mounting electrode and relocates the via conductor to the center. This removes the need for corner chamfering operations, as the via conductor at the center now serves as the stress distribution mechanism, thereby simplifying the manufacturing process.
3Reliability
If via conductor is positioned at corner portion of mounting electrode, then electrical connection is achieved, but stress concentration causes breakage or peeling
Solution Approach 1:
The via conductor is repositioned from the corner (peripheral dimension) to the center (central dimension) of the mounting electrode. This dimensional change maintains electrical connection functionality while fundamentally altering the stress distribution pattern, preventing concentration at corners and enabling uniform stress distribution across the entire electrode.
Data Source
AI summary
A via conductor connected to a mounting electrode near a corner portion of a circuit substrate is provided in a position in a corresponding mounting electrode, located closer to the center of the circuit substrate. Thus, concentration of a stress in a portion of the via conductor is effectively reduced, and a break, a chip, or a crack is prevented from occurring to the circuit substrate. Even if the portion located closer to the corner portion of the mounting electrode is peeled from the circuit substrate, the electrical characteristics of the circuit module are secured because disconnection between the corresponding mounting electrode and the via conductor is prevented.