Via Connecting Structure for Stub Reduction Without Back Drilling
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Solution Overview
Problem
Substrate processing by back drill to eliminate stubs reduces the wireable region, as it also removes part of the substrate around the stub, leading to output signal deterioration due to stub influence.
Innovation Solution
A connecting structure with capacitors or resistors connected between the terminals of vias on different surfaces of the substrate, reducing stub influence on output signals without decreasing the wireable region by eliminating the need for back drill processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If substrate processing by back drill is used to eliminate stubs, then output signal deterioration is suppressed, but wireable region in substrate is decreased
Solution Approach 1:
The invention extracts only the necessary portion (the stub extending from the via) while preserving the rest of the via structure. By selectively removing only the protruding stub portion rather than the entire via, the solution eliminates signal deterioration causes while maintaining the via's functional connection and preserving wireable region around it.
Solution Approach 2:
Instead of removing the entire via structure as in conventional back drill processing, the invention inverts the approach by preserving the via body and selectively eliminating only the harmful stub extension. This inverted strategy achieves the same signal quality improvement while avoiding collateral damage to the wireable region.
2Reliability
If back drill processing is performed to remove stubs, then stub influence on output signal is reduced, but part of substrate around stub is also removed
Solution Approach 1:
The invention extracts and removes only the specific harmful element (the stub extension from the via) while leaving the beneficial substrate material intact. This selective extraction approach eliminates the source of signal deterioration without causing unnecessary loss of functional substrate material that could be used for wiring.
Solution Approach 2:
The invention applies local quality by treating different portions of the via structure differently - the stub extension is eliminated to improve signal quality, while the main via body and surrounding substrate are preserved to maintain electrical connectivity and wireable area. This localized treatment optimizes each region's function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This structure effectively reduces the negative impact of stubs on output signals while maintaining the substrate's wireable area, improving frequency characteristics of insertion loss without requiring stub removal by drill or special structures.
Implementation Method 1
a first capacitor, one terminal of which being connected to a terminal of the first conductor that is on a first surface of the substrate, the other terminal of which being connected to a terminal of the second conductor that is on the first surface of the substrate
Implementation Method 2
a second capacitor or resistor, one terminal of which being connected to a terminal of the first conductor that is on a second surface of the substrate
Data Source
AI summary
The present invention addresses the problem of providing a connecting structure or similar that can minimize a decrease in a wireable region of a substrate while reducing the effect of stubs of a pair of vias on the output of a capacitor that is connected to said vias. In order to solve this problem, this connecting structure comprises: a first conductor that passes through a substrate and is provided with a first input/output section; a second conductor that passes through the substrate and is provided with a second input/output section; a first capacitor, one terminal of which being connected to a terminal of the first conductor that is on a first surface of the substrate, the other terminal of which being connected to a terminal of the second conductor that is on the first surface of the substrate; and a second capacitor or a resistor.