Via-Edge Antenna Layout for Compact Multi-Band 5G Devices
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Solution Overview
Problem
The increasing demand for multi-bandwidth antennas in 5G communication systems poses a challenge due to the limited space available in portable electronic devices, as the size of bezels and antenna installation areas decreases, necessitating a compact and efficient antenna design that can effectively transmit and receive RF signals across various bandwidths.
Innovation Solution
The antenna apparatus incorporates a ground plane with dielectric layers and vias, where the vias are strategically positioned to overlap the ground plane edges, providing additional return current paths and reducing coupling effects, allowing for efficient transmission and reception of RF signals with different polarizations without increasing the antenna's size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the antenna size is increased to improve bandwidth and gain, then the signal transmission performance is improved, but the available installation area in portable devices is limited
Solution Approach 1:
The patent utilizes the third dimension (vertical stacking) by placing multiple antenna patches and dielectric layers above the ground plane. This allows the antenna to achieve enhanced bandwidth and gain through multi-layer configuration without increasing the horizontal footprint, effectively resolving the contradiction between performance and installation area constraints.
Solution Approach 2:
The patent employs a nested structure where multiple antenna patches are stacked vertically with dielectric layers between them. The vias connect these nested layers to the ground plane, creating a compact multi-layer antenna system that achieves improved performance within a confined horizontal space.
2Reliability
If vias are positioned to overlap ground plane edges for improved return current paths, then bandwidth is enhanced, but coupling effects may increase
Solution Approach 1:
The patent applies local quality by strategically positioning vias at specific locations where they overlap the ground plane edges. This localized via placement creates beneficial return current paths that enhance bandwidth while the overall antenna design manages coupling effects through proper spacing and configuration of the multiple patches and layers.
Data Source
AI summary
An antenna apparatus includes: a ground plane including first sides parallel to a first direction and second sides parallel to a second direction, on a plane formed in the first and second directions; a dielectric layer disposed on the ground plane in a third direction; an antenna patch overlapping the ground plane in the third direction; and vias connected to the ground plane and passing through at least a portion of the dielectric layer. Edges of the vias at least partially overlap the first sides of the ground plane in the third direction.