Multilayer Capacitor Via Electrodes Groove Design
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Solution Overview
Problem
Current multilayer capacitors face limitations in increasing capacitance due to challenges in developing high-permittivity materials and reducing dielectric layer thickness, while also requiring miniaturization and reduced mounting area and height.
Innovation Solution
The design incorporates dielectric layers with increased overlapping areas of internal electrodes having different polarities, achieved through the use of groove parts and via electrodes that extend in the stacking direction, allowing for enhanced capacitance without thinning dielectric or internal electrode thicknesses, and features a lower surface mounting structure to decrease mounting area and acoustic noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of stacked dielectric layers and internal electrodes is increased to increase capacitance, then capacitance is improved, but the thickness of individual dielectric layers and internal electrodes must be decreased which is difficult to implement in current processes
Solution Approach 1:
The patent extends internal electrodes in the thickness direction (Z-axis) beyond the dielectric layers, creating groove parts and via electrodes that protrude from opposite surfaces. This dimensional extension allows electrodes to overlap over a greater effective area without requiring thinner dielectric layers, thus increasing capacitance while maintaining manufacturable thickness dimensions.
Solution Approach 2:
The internal electrodes are segmented into multiple parts: body portions within the dielectric layers, groove parts extending into the dielectric layers, and via electrodes protruding from opposite surfaces. This segmentation allows each portion to serve a specific function - the body portions provide capacitance, while the groove and via portions extend the overlapping area without compromising dielectric layer integrity.
2Quantity of substance
If the overlapping area of internal electrodes is increased to increase capacitance, then capacitance is improved, but the mounting area and mounting height of the capacitor increase
Solution Approach 1:
The groove parts and via electrodes are nested within and extending from the capacitor body structure. The via electrodes are formed within groove parts that are themselves part of the capacitor body, creating a compact nested arrangement that increases overlapping area without proportionally increasing the external mounting footprint.
Solution Approach 2:
The patent utilizes the thickness direction (Z-axis) to extend the overlapping area of internal electrodes through groove parts and via electrodes. This vertical extension in the third dimension allows increased capacitance without requiring proportional increases in the planar mounting area (X-Y plane).
3Quantity of substance
If high-permittivity materials are used to increase capacitance, then capacitance is improved, but material development becomes more difficult
Solution Approach 1:
Instead of changing material permittivity, the patent changes the geometric parameters of the internal electrodes - specifically extending them in the thickness direction to increase overlapping area. This parameter change in structure rather than material properties achieves increased capacitance while avoiding the difficulties of developing high-permittivity materials.
Data Source
AI summary
A multilayer capacitor includes a capacitor body including dielectric layers, first and second internal electrodes alternately disposed, with one of the dielectric layers interposed therebetween, and first and second groove parts formed in first and second surfaces of the capacitor body opposing each other to extend in a first direction in which the dielectric layers are stacked, and contacting the first and second internal electrodes, respectively; and first and second via electrodes formed in the first and second groove parts, respectively, and electrically connected to the first and second internal electrodes, respectively.