Via Hole Disposition Verification on Printed Circuit Boards
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Solution Overview
Problem
The existing methods for manufacturing multi-layer printed circuit boards are complex and costly, and manual checking of via holes in single-layer boards to ensure correct power or ground plane placement is inefficient and prone to errors, especially as layouts become more dense and via holes smaller and more numerous.
Innovation Solution
An automated method using an electronic data processing apparatus to determine via hole placement by segmenting geometric layouts, forming closed regions, and calculating directed angles to accurately identify whether via holes are within specific power or ground planes, thereby reducing human error and increasing testing accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multi-layer printed circuit board is used to form different power planes, then the function and electrical connection are improved, but the manufacturing process becomes too complex and production cost increases
Solution Approach 1:
The patent segments the single-layer board into multiple virtual power planes through geometric layout division. By dividing the board into distinct regions (first power plane region, second power plane region, ground plane region) using geometric boundaries, the system achieves multi-power-supply functionality without physically stacking multiple layers, thus simplifying manufacturing while maintaining adaptability.
2Measurement precision
If manual checking of via holes is performed, then accuracy can be verified, but the process is inefficient and prone to human errors
Solution Approach 1:
The patent implements self-service verification through automated computational geometry. The system automatically determines whether via holes are correctly positioned within the intended power or ground plane regions by calculating geometric relationships and directed angles, eliminating the need for manual inspection while ensuring high measurement precision and productivity.
3Area of stationary object
If layout becomes more concentrated with more via holes, then the area is reduced, but manual checking becomes no longer cost-effective and yield cannot be ensured
Solution Approach 1:
The patent replaces manual mechanical inspection with automated computational geometry systems. By using electronic data processing to calculate directed angles and determine via hole positions relative to geometric regions, the system handles dense layouts with numerous via holes efficiently, maintaining cost-effectiveness and ensuring yield while reducing the board area.
4Productivity
If automated checking method is implemented, then productivity and accuracy are improved, but device complexity increases
Solution Approach 1:
The patent changes the approach from manual visual inspection to automated computational parameter calculation. By transforming the checking process into mathematical operations (calculating directed angles, determining geometric region memberships), the system achieves high productivity and accuracy through algorithmic processing rather than complex physical inspection equipment.
Data Source
AI summary
A method for determining disposition of via hole on printed circuit board (PCB) includes the steps of: providing a PCB on which is disposed with a geometric layout and a via hole; providing a line on the PCB for intersecting the geometric layout to form a plurality of points of intersection; defining line segments by segmenting the line at each of the points of intersection to form a plurality of line segments; deleting some of the line segments having one end not being point of intersection for the geometric layout to form a plurality of segmented regions; searching a closed region by repeatedly searching region from any one of the points in the plurality of segmented regions; determining whether a closed region is a smallest closed region; determining whether a via hole is located within the smallest closed region.