Via-Hole Connection Structure for Pixel Electrode Overexposure

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Solution Overview

Problem

Display devices face challenges in maintaining high display quality due to issues such as reduced pixel electrode size, which can lead to over-exposure during photolithography, causing abnormal electrical connections and affecting storage capacitance.

Innovation Solution

A connection structure featuring a second wire electrically connected to a first wire through a through hole in an insulating layer, with the connection portion ending on the side wall of the through hole, reducing the risk of adjacent wire contact and optimizing exposure during photolithography.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the pixel electrode size is reduced to improve display resolution, then the display quality is improved, but the photolithography process causes over-exposure leading to abnormal electrical connections

Engineering Contradiction:
Improvepixel electrode size controlVSAvoidelectrical connection stability
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The pixel electrode is divided into a first electrode portion and a second electrode portion that are spatially separated and connected through a via hole. This segmentation allows each portion to be independently formed and controlled, preventing over-exposure issues while maintaining the required electrode size and electrical connection reliability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The connection between electrode portions is achieved by extending the second wire into the via hole to contact the first wire, utilizing the vertical dimension (Z-axis) through the insulating layer. This three-dimensional arrangement allows compact pixel design while maintaining proper electrical connections and avoiding photolithography over-exposure problems.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Manufacturing precision

If the pixel electrode size is reduced, then the display resolution is improved, but the storage capacitance is affected due to abnormal electrical connections

Engineering Contradiction:
Improvepixel electrode sizeVSAvoidstorage capacitance
Core Design Contradiction:
Manufacturing precisionVSQuantity of substance

Solution Approach 1:

By segmenting the pixel electrode into separate portions and connecting them through a controlled via hole structure, the design maintains adequate electrode area for storage capacitance while achieving high resolution. The segmented structure prevents abnormal electrical connections that would otherwise reduce effective capacitance.

Inventive Principle:
Principle #1Segmentation

3Reliability

If the connection portion of the second wire extends through the insulating layer, then electrical connection is achieved, but adjacent wires may contact causing short circuits

Engineering Contradiction:
Improveelectrical connectionVSAvoidshort circuit risk
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The via hole is designed with specific dimensional characteristics (smaller than the second wire) to create a precise local connection zone. This localized geometry ensures that only the intended connection point contacts the first wire, while the insulating layer walls prevent adjacent wires from making unintended contact, thus eliminating short circuit risks.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS20230420463A1Connection structure and electronic device including the same
Publication Date: 2023.12.28 INNOLUX CORP
  • US20230420463A1 patent drawing
  • US20230420463A1 patent drawing
  • US20230420463A1 patent drawing

AI summary

A connection structure and a display device including the connection structure are provided. The connection structure includes a first wire, a second wire, and an insulating layer. The insulating layer is disposed between the first wire and the second wire, and the insulating layer has a through hole surrounded by a side wall. A connection portion of the second wire is electrically connected to the first wire through the through hole. The connection portion of the second wire ends on the side wall of the through hole.