Dielectric Substrate Passive Part with Via Hole Resonator
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Solution Overview
Problem
Existing radio communication systems face challenges in reducing size while maintaining high electric characteristics and low loss due to issues with stray capacitance, conductor loss, and increased size when integrating filters and baluns in dielectric substrates, particularly with λ/4 resonators and λ/2 resonators.
Innovation Solution
A passive part design featuring a dielectric substrate with a filter, unbalanced to balanced converter, and a connector, where the resonator has a via hole connected to the ground electrode, reducing stray capacitance and conductor loss, and allowing for a folded structure to achieve a high Q value and smaller size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the filter and balun are formed integrally in a dielectric substrate, then the number and size of passive parts are reduced, but the conductor loss increases and Q value decreases due to small vertical thickness and large stray capacitance
Solution Approach 1:
The patent transitions from planar electrode arrangements to a three-dimensional laminated structure with via holes extending vertically through multiple dielectric layers. This vertical dimensionality allows the resonator electrodes to be positioned farther apart in the vertical direction while maintaining compact horizontal footprint, thereby reducing stray capacitance and conductor loss while keeping the integral structure
2Device complexity
If the resonant electrode and ground electrode are positioned closely to each other, then the filter and balun can be integrally combined, but large stray capacitance is produced which lowers the Q value
Solution Approach 1:
The patent uses via holes to create vertical separation between resonant electrodes and ground electrodes across multiple dielectric layers. This vertical dimensionality allows integral combination while maintaining sufficient electrical distance to minimize stray capacitance, thus preserving high Q value
Solution Approach 2:
The patent embeds multiple dielectric layers with ground electrodes and resonant electrodes in a nested laminated structure. Each layer is positioned and connected via via holes to create a compact three-dimensional configuration that achieves both integration and electrical isolation
3Volume of moving object
If the size of the dielectric substrate is reduced, then the passive part becomes smaller, but the length of the resonant electrode is reduced which requires folded structure and increases conductor loss
Solution Approach 1:
The patent extends the resonant electrode length in the vertical direction through via holes connecting multiple dielectric layers, allowing sufficient resonator length to be achieved within a compact horizontal footprint, thus avoiding the need for folded structures and reducing conductor loss
4Reliability
If a via hole is used to construct a λ/2 resonator, then the resonator can be formed, but the passive part is likely to have increased size in the laminated direction
Solution Approach 1:
The patent optimizes the via hole diameter and spacing parameters to achieve the required resonator electrical length while minimizing the vertical physical dimension. By carefully controlling these parameters, the design achieves compact size in the laminated direction while maintaining proper resonator function
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a high Q value and reduced size by minimizing conductor loss and stray capacitance, enabling efficient placement of electrodes and maintaining high electric characteristics even in compact configurations.
Implementation Method 1
the resonator has a via hole having an end connected to the ground electrode
Data Source
AI summary
A dielectric substrate includes a filter unit, a non-balance/balance conversion unit, and a connection unit for electrically connecting the filter unit to the non-balance/balance conversion unit which are formed in the dielectric substrate. A first resonator has an electrode formed on the main surface of a fourth dielectric layer and a via hole penetrating through a first to a third dielectric layers and connecting the electrode to a grounding electrode. A second resonator has an electrode formed on the main surface of the fourth dielectric layer and a via hole penetrating through the first to the third dielectric layers and connecting the electrode to the grounding electrode.