Through-Hole Via Inductor Balance Filter Design
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Solution Overview
Problem
Conventional high-density devices face challenges in minimizing size and enhancing electrical performance due to the space requirements of through-hole vias, which are primarily used for electrical connections between conductive layers.
Innovation Solution
The proposal involves utilizing through-hole vias as inductors in high-frequency devices, such as filters, by filling them with conductive material to create a through-hole via inductor that can be used for both electrical connection and inductive purposes, thereby optimizing space usage and improving electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through-hole vias are used solely for electrical connections between conductive layers, then reliable electrical connectivity is achieved, but device size increases due to the space required for dedicated connection structures
Solution Approach 1:
The through-hole via structure is designed to perform dual functions: providing electrical connection between conductive layers and serving as an inductor element for high-frequency signal processing. The via is filled with conductive material and configured to exhibit inductive properties, allowing it to function simultaneously as both a connection element and a functional circuit component, thereby eliminating the need for separate inductor structures and reducing overall device area.
2Reliability
If through-hole vias are enlarged to improve electrical connection quality, then connectivity reliability improves, but the space occupied by vias increases, reducing device density
Solution Approach 1:
The via structure is optimized by controlling the fill ratio of conductive material within the via hole. By adjusting parameters such as via diameter, depth, and conductive material fill percentage, the inductance value is tuned to achieve desired electrical performance for high-frequency applications while maintaining compact dimensions. This parameter optimization allows the via to provide both reliable connectivity and functional inductance without requiring excessive space.
3Reliability
If conventional inductors are added to achieve high-frequency performance, then electrical performance improves, but device complexity and size increase
Solution Approach 1:
The electrical connection function and inductor function are merged into a single integrated structure. The through-hole via, originally designed solely for connectivity, is modified by filling it with conductive material and configuring its geometry to exhibit inductive characteristics. This merging eliminates the need for separate inductor components and their associated traces, thereby reducing device complexity while achieving the required high-frequency performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for a reduction in device size and enhances electrical performance by leveraging the inductive properties of the conductive material within the through-hole vias, particularly at high frequencies, while maintaining effective electrical connections.
Implementation Method 1
a first through-hole via inductor substantially disposed in the substrate; and a second through-hole via inductor substantially disposed in the substrate
Data Source
AI summary
The invention discloses a balance filter formed from a combination of a first circuit and a second circuit, wherein both the first circuit and the second circuit have at least one through-hole via inductor. The balance filter is connected to an IC through a first terminal and a second terminal, wherein a power trace is disposed between the first circuit and the second circuit to deliver the power to the IC.