Via Insulating Layer Thickness Uniformity Groove Segmentation
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Solution Overview
Problem
Conventional methods for forming vias in substrates result in insulating layers with limited thickness and uneven thickness distribution, leading to non-uniform electrical capacity due to the use of chemical vapor deposition, which complicates the manufacturing process and increases costs.
Innovation Solution
A method involving the formation of grooves on a substrate, deposition of conductive metal, and subsequent formation of annular grooves surrounding the metal, followed by the simultaneous deposition of polymer insulating material in both central and annular grooves, allowing for thicker and even insulating layers, simplifying the manufacturing process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If chemical vapor deposition is used to form the insulating layer on the side wall of grooves, then the insulating layer can be formed, but the thickness is limited to under 0.5 μm and is not uniform
Solution Approach 1:
The groove structure is segmented into multiple regions: a central groove for conductive metal, surrounded by an annular groove for insulating material. This segmentation allows different materials to be deposited in controlled zones, enabling uniform insulating layer formation while maintaining manufacturing feasibility.
Solution Approach 2:
The patent transitions from a single-groove structure to a multi-dimensional groove system with central and annular grooves at different radial positions. This dimensional arrangement enables independent control of insulating material deposition in the annular groove, achieving uniform thickness that was not possible with conventional single-groove chemical vapor deposition.
2Reliability
If the insulating layer thickness is increased to improve electrical capacity, then electrical capacity improves, but the thickness becomes uneven and manufacturing complexity increases
Solution Approach 1:
Different regions of the via structure are assigned different materials and functions: the central groove contains conductive metal for electrical connection, while the annular groove contains insulating material for electrical isolation. This local differentiation allows the insulating layer to be optimized for uniform thickness and adequate thickness independently of the conductive metal region, improving electrical capacity uniformity without excessive complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the formation of thicker, evenly distributed insulating layers, enhancing electrical capacity and simplifying the manufacturing process while reducing costs by using polymers for specific processes and omitting additional manufacturing steps.
Implementation Method 1
forming an insulating material in the central groove and the annular groove
Data Source
AI summary
The present invention relates to a method for forming a via in a substrate and a substrate with a via. The method includes the following steps: (a) providing a substrate; (b) forming a groove on a first surface of the substrate; (c) forming a conductive metal on the groove so as to form a central groove; (d) forming an annular groove that surrounds the conductive metal; (e) forming an insulating material in the central groove and the annular; groove; and (f) removing part of the substrate to expose the conductive metal and the insulating material.