Via Insulation Polymer Deposition for Thickness Uniformity
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Solution Overview
Problem
Conventional methods for forming vias in substrates result in insulation layers with limited thickness and non-uniform thickness on side walls, affecting electrical capacity due to the use of chemical vapor deposition for insulation layer formation.
Innovation Solution
A method involving the formation of a photo resist layer, pattern creation, groove and pillar formation, polymer deposition within the groove, removal of the pillar to create an accommodating space, and subsequent conductive metal insertion, allowing for thicker and uniformly thick polymer insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If chemical vapor deposition is used to form the insulation layer on the side wall of grooves, then the insulation layer can be formed, but the thickness is limited to under 0.5 μm and is not uniform
Solution Approach 1:
The patent changes the deposition method from chemical vapor deposition to a different process that enables thicker and more uniform insulation layer formation. This parameter change in the manufacturing process allows achieving both increased thickness and improved uniformity, resolving the contradiction between thickness limitation and thickness uniformity.
2Reliability
If the insulation layer thickness is increased to improve electrical capacity, then electrical capacity improves, but the conventional chemical vapor deposition method cannot achieve thickness over 0.5 μm
Solution Approach 1:
By changing the deposition method parameter, the patent enables formation of insulation layers thicker than 0.5 μm, which directly improves electrical capacity while maintaining manufacturing feasibility.
3Ease of manufacture
If chemical vapor deposition is used to form the insulation layer, then the process can be completed, but the thickness on upper side wall differs from lower side wall
Solution Approach 1:
The patent changes the manufacturing process parameter from chemical vapor deposition to an alternative method that achieves both process feasibility and improved thickness uniformity across different wall positions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the use of polymers as insulation materials with varying compositions and achieves uniform thickness, enhancing electrical capacity by addressing the limitations of conventional methods.
Implementation Method 1
forming a polymer in the groove of the substrate
Data Source
AI summary
The present invention relates to a method for forming vias in a substrate, comprising the following steps: (a) providing a substrate having a first surface and a second surface; (b) forming a photo resist layer on the first surface of the substrate; (c) forming a pattern on the photo resist layer; (d) forming a groove and a pillar in the substrate according to the pattern, wherein the groove surrounds the pillar; (e) forming a polymer in the groove of the substrate; (f) removing the pillar of the substrate to form an accommodating space; (g) forming a conductive metal in the accommodating space; and (h) removing part of the second surface of the substrate to expose the conductive metal and the polymer. As a result, thicker polymer can be formed in the groove, and the thickness of the polymer in the groove is uniform.