Via Insulation Thickness Uniformity Using Polymer Mediator
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Solution Overview
Problem
Conventional methods for forming vias in substrates result in insulating layers with limited thickness and uneven thickness distribution on side walls, leading to non-uniform electrical capacity due to the use of chemical vapor deposition for forming silicon dioxide insulating layers.
Innovation Solution
A method involving the formation of grooves in a substrate, filling with conductive metal, creating an accommodating space, and using polymer as an insulating material within this space, allowing for thicker and even insulating layers by methods such as vacuuming, vent connection, or spray coating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If chemical vapor deposition is used to form silicon dioxide insulating layer, then the insulating layer can be formed on the side wall of grooves, but the thickness is limited to under 0.5 μm and is not even
Solution Approach 1:
The patent introduces an intermediary material (polymer or spin-on-glass) that is deposited onto the groove side walls before filling with insulating material. This intermediary layer serves as a mold or template that enables subsequent insulation material to be deposited in a controlled manner, achieving both greater thickness and improved uniformity that cannot be achieved through chemical vapor deposition alone.
Solution Approach 2:
The patent replaces the chemical vapor deposition process with a mechanical filling process. Instead of using vapor-phase chemical reactions that limit thickness and uniformity, the invention uses liquid or paste insulating materials that are mechanically filled into the grooves, allowing for greater thickness control and more uniform distribution.
2Reliability
If chemical vapor deposition is used to form insulating layer, then the process can be completed, but the electrical capacity is not uniform
Solution Approach 1:
The intermediary polymer or spin-on-glass layer acts as a precise template that ensures uniform spacing and thickness control. This intermediary structure guarantees that the final insulating layer achieves uniform electrical capacity by maintaining consistent geometric relationships throughout the filling process.
Data Source
AI summary
A method for forming vias in a substrate, including the following steps: (a) providing a substrate having a first surface and a second surface; (b) forming a groove on the substrate; (c) filling the groove with a conductive metal; (d) removing part of the substrate which surrounds the conductive metal, wherein the conductive metal is maintained so as to form an accommodating space between the conductive metal and the substrate; (e) forming an insulating material in the accommodating space; and (f) removing part of the second surface of the substrate to expose the conductive metal and the insulating material. In this way, thicker insulating material can be formed in the accommodating space, and the thickness of the insulating material in the accommodating space is even.