Via Interconnection Structure for Signal Integrity
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Solution Overview
Problem
Existing interconnection structures for multilayer circuit boards and IC packaging suffer from signal integrity issues due to electromagnetic interference (EMI), impedance discontinuity, and increased insertion losses caused by EM wave leakage and non-optimal current return paths.
Innovation Solution
A novel interconnection structure incorporating a 4-via configuration with impedance control, capacitive elements, and differential signaling, utilizing a metal frame and surrounding vias to provide continuous current return paths and voltage references, reducing EM coupling and impedance discontinuity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional interconnection structures are used to connect multilayer circuit boards, then the structure is simple and easy to manufacture, but electromagnetic interference causes signal integrity degradation and increased insertion losses
Solution Approach 1:
The interconnection structure is divided into multiple functional segments: signal vias for signal transmission, ground vias for electromagnetic shielding and reference potential, and power vias for power supply. Each segment performs a specific function to collectively improve signal integrity while managing complexity through functional specialization.
Solution Approach 2:
The patent implements a nested via structure where signal vias are surrounded by ground vias, which are in turn surrounded by power vias. This concentric nesting arrangement creates multiple layers of electromagnetic shielding and reference planes, reducing EMI and improving signal integrity without requiring completely separate structural elements.
2Object-affected harmful factors
If ground vias are added to provide electromagnetic shielding, then EM wave leakage is reduced, but the current return path becomes longer and more complex
Solution Approach 1:
Ground vias are positioned locally adjacent to signal vias rather than using a single distant ground connection. This local placement creates short, direct current return paths for each signal via, minimizing inductance and path length while providing effective electromagnetic shielding at the specific location where signals are transmitted.
3Reliability
If impedance control measures are implemented, then signal quality is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent controls impedance by changing geometric parameters of the via structure, specifically the diameter of signal vias, the spacing between ground vias, and the thickness of dielectric layers. These parameter adjustments allow impedance matching without requiring extremely tight tolerances on via placement positions, making the design more manufacturable while maintaining signal quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The novel structure enhances signal integrity by minimizing EM radiation, crosstalk, and insertion losses, providing improved energy coupling and stability for signal transmission.
Implementation Method 1
The EM waves will not penetrate through the two ground vias (or power vias) 64 and 66 on the top PCB 51, the two ground vias (or power vias) 65 and 67 on the bottom PCB 52 and the metal frame 75 of the interconnection structure 53
Implementation Method 2
A novel interconnection structure incorporating a 4-via configuration with impedance control, capacitive elements, and differential signaling
Implementation Method 3
A novel interconnection structure incorporating a 4-via configuration with impedance control, capacitive elements, and differential signaling, utilizing a metal frame and surrounding vias to provide continuous current return paths and voltage references
Data Source
AI summary
The embodiment of the invention is about a novel interconnection structure which can be incorporated into a variety of connectors, as well as other types of interconnections in order to reduce crosstalk, to improve signal integrity and to achieve EM emission compliance. A 4-via (2 signal vias, 1 power via, and 1 ground via) interconnection structure was used for demonstrating the effect of the novel interconnection structure. The same concept can be applied to any multi-via and multi-layer interconnection structure such as PCB, IC packaging circuit, or die circuit. Vias that have an electrical property can be added adjacent to the basic 4-via interconnection structure to achieve a multi-via interconnection structure. For 1-via (1 signal via or 1 power via), 2-via (1 signal via and 1 ground via or 1 signal via and 1 power via) and 3-via (1 signal via, 1 ground via, and 1 power via) interconnection structure, the proposed interconnection structure based upon the same concept can be applied as well.