Via Connection Metal Placement in Display Sub-Pixels
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Solution Overview
Problem
In display apparatuses with reduced peripheral areas to increase the display area, the space for elements in the peripheral area is minimized, leading to potential deterioration in the quality of light emitted from light-emitting diodes.
Innovation Solution
A display apparatus is designed with first, second, and third sub-pixels arranged to emit different colors, where specific driving circuits and via connection metals are strategically positioned to optimize light emission and reduce parasitic capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the peripheral area is reduced to increase the display area proportion, then the display area proportion is improved, but the space for elements in the peripheral area is reduced leading to deterioration in light emission quality
Solution Approach 1:
The patent repositions via connection metals from traditional peripheral locations to spaces between adjacent sub-pixels within the display area. This spatial relocation in a different dimensional arrangement allows connection metals to be placed in previously unused inter-pixel spaces, effectively increasing the display area proportion while maintaining proper electrical connections and light emission quality.
Solution Approach 2:
The patent applies different spatial arrangements to different elements: light-emitting diodes are positioned at vertices of an imaginary quadrangle centered on the second sub-pixel, while via connection metals are strategically placed in the spaces between adjacent sub-pixels. This localized optimization ensures each element occupies the most suitable position for its function, maintaining light emission quality while maximizing display area.
2Area of stationary object
If elements are densely arranged to maximize display area, then the display area proportion is improved, but parasitic capacitance increases due to overlap between conductive lines and light-emitting diodes
Solution Approach 1:
The patent extracts the via connection metals from their traditional positions where they would overlap with light-emitting diodes and conductive lines. By relocating these connection metals to the spaces between adjacent sub-pixels, the harmful overlap and resulting parasitic capacitance are eliminated while maintaining electrical connectivity.
Solution Approach 2:
The spaces between adjacent sub-pixels serve as intermediary zones that accommodate via connection metals without causing interference with light-emitting diodes or conductive lines. This intermediary positioning resolves the conflict between dense element arrangement and parasitic capacitance reduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the display apparatus to provide high-resolution and high-quality images by efficiently utilizing the available space and minimizing the overlap between conductive lines and light-emitting diodes, thereby reducing undesired parasitic capacitance.
Implementation Method 1
first, second, and third sub-pixels arranged in a display area to emit light of different colors from each other
Data Source
AI summary
A display apparatus includes a first first sub-pixel and a first third sub-pixel at two vertices adjacent in a row direction of an imaginary quadrangle centered on a first second sub-pixel, and first first, first second, and first third light-emitting diodes respectively corresponding to the first first, first second, and first third sub-pixels. The first first, first second, and first third light-emitting diodes are respectively connected to first first, first second, and first third driving circuits via first first, first second, and first third via connection metals. A first contact of the first first light-emitting diode and the first first via connection metal is between the first first and the first third sub-pixels adjacent in the row direction, and a second contact of the first second light-emitting diode and the first second via connection metal is between the first first and a second third sub-pixels adjacent in the column direction.