Via-Connected Multilayer Capacitor Layout for High Capacitance Density
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
As electronic devices and electrical devices undergo high performance and ultra-high density integration, the miniaturization of multilayer capacitors becomes increasingly important, but it is challenging to improve capacitance-to-volume ratio as capacitors are miniaturized.
Innovation Solution
A multilayer capacitor design featuring a body with a capacitance region where first and second internal electrodes are alternately laminated with dielectric layers, and external electrodes covering more than half of the body surfaces, along with via electrodes connecting internal and external electrodes, enhancing capacitance distribution and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the multilayer capacitor is miniaturized, then the size is reduced, but the capacitance to volume ratio deteriorates
Solution Approach 1:
The patent transitions from conventional planar electrode arrangements to a three-dimensional stacked configuration where internal electrodes are arranged in multiple layers alternating with dielectric layers. This vertical stacking in the thickness direction enables increased capacitance density without increasing the planar footprint, effectively resolving the contradiction between miniaturization and capacitance-to-volume ratio.
Solution Approach 2:
The patent implements a nested structure where multiple internal electrodes are embedded within the dielectric layers, forming a compact multi-layered assembly. The external electrodes wrap around and connect to these nested internal electrodes, creating a space-efficient configuration that maximizes capacitance within a minimized volume.
2Object-generated harmful factors
If the current path is minimized, then the equivalent series inductance is reduced, but the structural complexity increases
Solution Approach 1:
The patent divides the current path into multiple parallel segments through the stacked internal electrodes and corresponding via electrodes. By creating multiple current flow paths from different internal electrodes to external electrodes, the overall inductance is reduced while the modular segmented structure manages the complexity through systematic repetition of electrode-dielectric units.
Solution Approach 2:
The patent utilizes the vertical dimension with via electrodes penetrating through dielectric layers to create direct short-current paths between internal and external electrodes. This three-dimensional current path configuration minimizes inductance by reducing current loop areas, while the regular stacking pattern manages structural complexity through dimensional organization.
Data Source
AI summary
A multilayer capacitor includes: a body including a capacitance region in which at least one first internal electrode and at least one second internal electrode are alternately laminated in a first direction with at least one dielectric layer interposed therebetween; and first and second external electrodes spaced apart from each other and respectively disposed on first and second surfaces of the body, the first and second surfaces opposing each other. The body further includes a first via electrode, connecting the at least one first internal electrode and the first external electrode to each other in the first direction, and a second via electrode connecting the at least one second internal electrode and the second external electrode to each other in the first direction.