Conductive Via Offset Structure for Compact Semiconductor Packaging
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Solution Overview
Problem
Conventional semiconductor packaging structures are limited in reducing the lateral dimension due to the presence of vias in second protrusions, leading to issues such as increased impedance and filling defects in conductive vias, which affect the performance and yield of electronic devices.
Innovation Solution
The via in the second substrate is offset towards the inner side, reducing the dimension of the second protrusion, and incorporating a funnel-shaped via structure with protective layers to enhance stability and prevent conductor leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vias are included in second protrusions for conductor connection, then electrical connectivity is achieved, but lateral dimension of packaging structure increases
Solution Approach 1:
The conductive via is offset from the second protrusion toward the inner side of the packaging structure, effectively moving the via position to a different spatial dimension. This offset arrangement allows the via to serve its electrical connection function while reducing the lateral footprint of the second protrusion, thereby decreasing the overall packaging dimension without compromising connectivity.
Solution Approach 2:
The structure separates the functions of the second protrusion and the conductive via. The second protrusion is reduced in dimension and the via is positioned independently at an offset location, dividing the monolithic via-containing protrusion into distinct functional elements that can be optimized separately for both connectivity and space efficiency.
2Area of stationary object
If second protrusion dimension is reduced to decrease packaging size, then lateral dimension is decreased, but conductor attachment stability deteriorates
Solution Approach 1:
A bonding layer is introduced as an intermediary element between the reduced second protrusion and the conductor. This bonding layer provides a stable attachment surface for the conductor even when the second protrusion dimension is minimized, ensuring reliable conductor attachment while maintaining the compact packaging structure.
Solution Approach 2:
The invention changes the dimensional parameters of the second protrusion, reducing its lateral size while maintaining or adjusting its height. This parameter modification allows the protrusion to be compact yet still provide adequate support when combined with the offset via arrangement and bonding layer for stable conductor attachment.
3Area of stationary object
If via is offset towards inner side to reduce second protrusion dimension, then packaging structure dimension is reduced, but manufacturing complexity increases
Solution Approach 1:
The conductive via is pre-positioned at an offset location during the manufacturing process, before final assembly steps. This preliminary positioning of the via at its offset location simplifies subsequent assembly operations and ensures the reduced protrusion dimension is achieved without requiring complex post-processing or adjustment procedures.
Data Source
Figure 1~2
Figure 3A~3B
Figure 4~5A
AI summary
A semiconductor device, including: first and second substrates (10, 20), wherein an accommodating space is formed between the first and second substrates; a semiconductor element disposed on the second substrate (20) in the accommodating space, wherein the semiconductor element includes pins (C2, C3) used for an electrical connection; an annular supporting protrusion (21) provided between the first and second substrates (10, 20), wherein the supporting protrusion (21), the first substrate (10), and the second substrate (20) together define the accommodating space; at least one second protrusion (22) provided at the inner side of the supporting protrusion (21) and located in the accommodating space; a conductor layer (70, 72) provided on the surface of the second protrusion (22), and including a first connection portion (70) and a via connection portion (72), wherein the first connection portion (70) is provided on the end surface of the second protrusion (22) and electrically connected to the pins (C2, C3), and the via connection portion (72) extends along one side of the second substrate (20); and a conductive via (23) provided in the second substrate (20) and electrically connected to the via connection portion (72). In a top view, the conductive via (23) is located at the inner side of the second protrusion (22) or is spaced apart from the second protrusion (22), or the conductive via (23) is not overlapped with the end surface of the second protrusion (22). Also involved is an electronic device including the semiconductor device.