Via-Integrated Optical Waveguide for Shared Electric-Photonic Routing
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Solution Overview
Problem
Existing optoelectronic substrates face challenges in efficiently integrating electric and photonic signals due to limited space, as they follow independent structural pathways, leading to competition for space and limiting the growth of I/O port numbers.
Innovation Solution
A substrate structure with a waveguide inside a via, where an optical waveguide is integrated within the via channel, allowing simultaneous transportation of electric and photonic signals through the via metal layer and optical waveguide, respectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate pathways are used for electric and photonic signals, then each signal type can be transported independently, but the space required increases and I/O port growth is limited
Solution Approach 1:
The patent combines electric and photonic signal transport into a single via structure. The via contains both a via metal layer for electric signals and a via optical waveguide for photonic signals, allowing both signal types to share the same physical pathway through the substrate, thereby reducing the total space required while maintaining independent signal transport capability
Solution Approach 2:
The optical waveguide is nested within the via structure, which also contains the via metal layer. This nested arrangement allows the photonic circuit to be embedded within the same vertical channel used by the electric circuit, maximizing space utilization and enabling both signal types to coexist in a compact configuration
2Productivity
If I/O port numbers are increased, then signal transport capacity improves, but the limited substrate space makes layout increasingly difficult
Solution Approach 1:
The patent transitions from horizontal to vertical signal transport by routing both electric and photonic signals through vertical vias. This dimensional change allows multiple I/O ports to be stacked vertically rather than spread horizontally, increasing signal transport capacity while reducing layout complexity and improving space utilization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration saves space by allowing both signals to be transported efficiently across the same passage, alleviating the need for separate layouts of electric and photonic circuits, thus enhancing integration and efficiency in signal transport.
Implementation Method 1
an electric signal is able to be transported across the via through the via metal layer
Implementation Method 2
a photonic signal is able to be simultaneously transported across the via through the via optical waveguide
Data Source
AI summary
A substrate structure with a waveguide inside of a via includes a core substrate layer. The core substrate layer includes a first surface and a second surface opposite to each other, and a via that communicates the two surfaces. A via metal layer is formed on an inner wall of the via, and the via includes a via channel that communicates the first surface and the second surface. An optical waveguide unit is formed in the via channel, and the optical waveguide unit includes a via optical waveguide. The substrate structure is utilized for transporting an electric signal through the via metal layer and a photonic signal through the via optical waveguide simultaneously through the same via, and thus conserving available space for forming vias on an optoelectronic substrate. This allows a transportation of the electric signal and the photonic signal to be more integrated.